Unlimited field-of-view focus stacking microscopy based on tilted imaging

Y Yang Shen (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics) Y Yian Huang (School of Automation and Intelligent Sensing, Shanghai Jiao Tong University 1 , Shanghai 200240,) Y Yuan Qu J Jiamiao Yang (School of Automation and Intelligent Sensing, Shanghai Jiao Tong University 1 , Shanghai 200240,)

Abstract

Focus stacking microscopy achieves high-resolution, all-in-focus imaging through multi-focus image fusion and is widely applied in fields such as biology, materials science, and semiconductor inspection. However, for large-scale samples, conventional methods require pausing at each depth-of-field imaging position to capture a multi-focus image stack, which introduces mechanical backlash errors, reducing inspection efficiency and stitching accuracy, and thus fails to meet the requirements for all-in-focus, large field-of-view (FOV), and high-throughput inspection. Here, we propose an unlimited FOV focus stacking microscopy method based on tilted imaging (TI-FSM). By tilting the microscopy system, we decompose the sample's one-dimensional displacement into motion along and perpendicular to the optical axis, where the former is used to acquire a multi-focus image stack for all-in-focus scanning, while the latter enables unlimited FOV expansion. Additionally, we employ a joint texture–topography reconstruction algorithm to achieve simultaneous reconstruction of texture and 3D topography. Experimental results demonstrate that using a microscopy system with an NA of 0.28, TI-FSM achieves a vertical reconstruction accuracy of 16.2 μm. It enables unlimited FOV expansion and exhibits strong all-in-focus imaging and 3D topography measurement capabilities for large-scale, complex-structured surfaces.

Article Details

Volume / Issue Vol. 128, Issue 18
Published May 04, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (4)

Y

Yang Shen

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics

Y

Yian Huang

School of Automation and Intelligent Sensing, Shanghai Jiao Tong University 1 , Shanghai 200240,

Y

Yuan Qu

J

Jiamiao Yang

School of Automation and Intelligent Sensing, Shanghai Jiao Tong University 1 , Shanghai 200240,