Ultra-low thermal conductivity in nanoscale, epitaxial SnS grains

M Michael Rohde (Institute of Condensed Matter and Nanosciences, Université Catholique de Louvain (UCLouvain) 1 , 1348 Louvain-la-Neuve,) A Alessandra Canetta (IMCN, Université Catholique de Louvain (UCLouvain) 1 , 1348 Louvain-la-Neuve,) Y Yubin Huang P Philip S. Dobson (James Watt School of Engineering, University of Glasgow 4 , Glasgow G12 8LT,) J Jonathan M. R. Weaver (James Watt School of Engineering, University of Glasgow 4 , Glasgow G12 8LT,) C Clement Merckling (Department of Materials Engineering, KU Leuven 1 , Kasteelpark Arenberg 44, 3001 Leuven,) F Francisco Molina-Lopez (Department of Material Engineering, KU Leuven 2 , 3001 Leuven,) J Jean Spièce (IMCN, Université Catholique de Louvain (UCLouvain) 1 , 1348 Louvain-la-Neuve,) P Pascal Gehring

Abstract

Thermally insulating nanoscale building blocks enable efficient routes to both passive and active heat management in miniaturized architectures. However, identifying suitable nanomaterials by computational and experimental means is difficult as critical dimensions reach the scale of thermal carriers and thermal interfaces become dominant. In this work, we propose epitaxially grown layered SnS as an outstanding thermal insulator at the thin film limit. The challenge of measuring heat transport at the nanoscale was tackled by locally probing out-of-plane thermal transport on grains of varying thickness utilizing scanning thermal microscopy. We consistently find an ultra-low thermal conductivity value of 45 mWm−1K−1, which is among the lowest reported for dense solids to date. This finding challenges previous predictions of the SnS system and opens up promising prospects for its integration into heat management components.

Article Details

Volume / Issue Vol. 127, Issue 19
Published November 10, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (9)

M

Michael Rohde

Institute of Condensed Matter and Nanosciences, Université Catholique de Louvain (UCLouvain) 1 , 1348 Louvain-la-Neuve,

A

Alessandra Canetta

IMCN, Université Catholique de Louvain (UCLouvain) 1 , 1348 Louvain-la-Neuve,

Y

Yubin Huang

P

Philip S. Dobson

James Watt School of Engineering, University of Glasgow 4 , Glasgow G12 8LT,

J

Jonathan M. R. Weaver

James Watt School of Engineering, University of Glasgow 4 , Glasgow G12 8LT,

C

Clement Merckling

Department of Materials Engineering, KU Leuven 1 , Kasteelpark Arenberg 44, 3001 Leuven,

F

Francisco Molina-Lopez

Department of Material Engineering, KU Leuven 2 , 3001 Leuven,

J

Jean Spièce

IMCN, Université Catholique de Louvain (UCLouvain) 1 , 1348 Louvain-la-Neuve,

P

Pascal Gehring