Tuning the interfacial properties of stacked gate dielectrics on silicon carbide by inserting h-BN layer

X Xuan Tang (Key Laboratory for Advanced Materials, Feringa Nobel Prize Scientist Joint Research Center, School of Chemistry and Molecular Engineering) J Jingren Chen (Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences 2 , Beijing 100049,) Z Zhanwei Shen Y Yuyang Miao (Department of Medicine-Huddinge, Karolinska Institutet) J Ji Jiang X Xiaogang Zhu (Department of Physics, College of Physical Science and Technology, Xiamen University 4 , Xiamen 361005,) Y Yu Huang J Jinyi Xu (State Key Laboratory of Natural Medicines and Department of Medicinal Chemistry, China Pharmaceutical University) H Hangshuo Shi (Laboratory of Solid-State Optoelectronics Information Technology, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences 1 , Beijing 100083,) S Shizhong Yue (Laboratory of Solid-State Optoelectronics Information Technology, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences 1 , Beijing 100083,) F Feng Zhang X Xingwang Zhang (Key Laboratory of Biomass Chemical Engineering of Ministry of Education, College of Chemical and Biological Engineering) Z Zhijie Wang (Research Institute of Photocatalysis, State Key Laboratory of Photocatalysis on Energy and Environment, College of Chemistry)

Abstract

Silicon carbide (SiC) has significant potential for applications in high-voltage, high-temperature, and high-power devices, such as fast charging systems, grid-connected power systems, and switching power supplies. However, the performance of SiC-based metal–oxide–semiconductor field-effect-transistor devices is greatly limited by low channel mobility due to the high density of interface states at the SiO2/SiC interface. To address the issue of interface states, we have fabricated SiC-based metal–insulator–semiconductor capacitors featuring a stacked gate dielectric architecture (h-BN/Al2O3) and compared the effects of inserting h-BN thickness on the electrical properties of these capacitors. The insertion of a thin h-BN layer reduces the interface state density by more than two orders of magnitude compared to the structure with a single Al2O3 dielectric. Moreover, the stacked gate dielectric results in a notable reduction in the leakage current density from 5.19 × 10−2 to 3.78 × 10−9 A/cm2 at 4 MV/cm, accompanied by a reduction in the flatband voltage shift from 0.14 to 0.07 V. Such benefits originate from the improved band offset of 2.22 eV and the N atom passivation effect between the h-BN and SiC. These results present a practical solution for enhancing the performance of SiC/h-BN nanoelectronics, optoelectronics, and power electronics devices.

Article Details

Volume / Issue Vol. 127, Issue 15
Published October 13, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (13)

X

Xuan Tang

Key Laboratory for Advanced Materials, Feringa Nobel Prize Scientist Joint Research Center, School of Chemistry and Molecular Engineering

J

Jingren Chen

Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences 2 , Beijing 100049,

Z

Zhanwei Shen

Y

Yuyang Miao

Department of Medicine-Huddinge, Karolinska Institutet

J

Ji Jiang

X

Xiaogang Zhu

Department of Physics, College of Physical Science and Technology, Xiamen University 4 , Xiamen 361005,

Y

Yu Huang

J

Jinyi Xu

State Key Laboratory of Natural Medicines and Department of Medicinal Chemistry, China Pharmaceutical University

H

Hangshuo Shi

Laboratory of Solid-State Optoelectronics Information Technology, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences 1 , Beijing 100083,

S

Shizhong Yue

Laboratory of Solid-State Optoelectronics Information Technology, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences 1 , Beijing 100083,

F

Feng Zhang

X

Xingwang Zhang

Key Laboratory of Biomass Chemical Engineering of Ministry of Education, College of Chemical and Biological Engineering

Z

Zhijie Wang

Research Institute of Photocatalysis, State Key Laboratory of Photocatalysis on Energy and Environment, College of Chemistry