Thermal boundary conductance under large temperature discontinuities of ultrathin Pb(111) films on Si(111)

C Christian Brand (Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,) T Tobias Witte (Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,) M Mohammad Tajik (Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,) J Jonas D. Fortmann (Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,) B Birk Finke (Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,) H Herbert Pfnür (Institut für Festkörperphysik, Leibniz Universität Hannover 2 , 30167 Hannover,) C Christoph Tegenkamp (Department of Physics Chemnitz University of Technology Reichenhainer Str. 70 09126 Chemnitz Germany) M Michael Horn-von Hoegen (Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,)

Abstract

Heat transfer is a critical aspect of modern electronics, and a deeper understanding of the underlying physics is essential for building faster, smaller, and more powerful devices with improved performance and efficiency. In such nanoscale structures, the heat transfer between two materials is limited by the finite thermal boundary conductance across their interface. Using ultrafast electron diffraction under grazing incidence we investigated the heat transfer from ultrathin epitaxial Pb films to an Si(111) substrate under strong nonequilibrium conditions. Upon applying an intense femtosecond laser pulse, the 5–7 ML thin Pb film undergoes rapid heating by 10–120 K while the Si substrate remains cold at ≈10 K. At such large temperature discontinuities, a significantly faster cooling is observed for more strongly excited Pb films. The decrease in the corresponding cooling time constant is explained by variations in thermal boundary conductance, interpreted within the framework of the diffuse mismatch model. The thermal boundary conductance is reduced by more than a factor of three in comparison with Pb films grown on H-terminated substrates, underscoring the importance of substrate, heterofilm, and interface morphologies.

Article Details

Volume / Issue Vol. 127, Issue 17
Published October 23, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

C

Christian Brand

Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,

T

Tobias Witte

Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,

M

Mohammad Tajik

Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,

J

Jonas D. Fortmann

Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,

B

Birk Finke

Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,

H

Herbert Pfnür

Institut für Festkörperphysik, Leibniz Universität Hannover 2 , 30167 Hannover,

C

Christoph Tegenkamp

Department of Physics Chemnitz University of Technology Reichenhainer Str. 70 09126 Chemnitz Germany

M

Michael Horn-von Hoegen

Faculty of Physics, University of Duisburg-Essen 1 , 47057 Duisburg,