The <i>V</i>th shift mechanism in MIFIS FeFET: A field-driven perspective
Abstract
Hafnium-based ferroelectric field-effect transistor (FeFET) has demonstrated potential for 3D NAND applications. By introduction of a gate interlayer (GIL), the metal–interlayer–ferroelectric–interlayer–semiconductor (MIFIS) FeFET overcomes the classical limitation imposed by the coercive field (Ec) and ferroelectric thickness (tFE), enabling an expanded memory window (MW). While existing models attribute the MW to polarization and trapped charges scaled by ferroelectric and GIL capacitances, the field-driven threshold voltage (Vth) shift mechanism remains unexplored. To bridge the gap, we propose a two-step load-line model by incorporating a threshold field (Eth)-driven Vth shift mechanism. In this framework, we treat the GIL as a tunnel-switch layer controlled by Eth instead of an ideal capacitor. Simulations capture the device behavior and reveal an analytical expression for MW prediction, demonstrating a direct dependence of MW on Ec and Eth. This work establishes a field-driven perspective, offering a viable paradigm for designing and operating MIFIS FeFET devices.
Article Details
Journal Info
Applied Physics Letters
American Institute of Physics
Authors (16)
Hao Xu
Saifei Dai
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Xianzhou Shao
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Min Liao
Zeqi Chen
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Tao Hu
Runhao Han
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Jia Yang
Key Laboratory of Green Chemistry & Technology, Ministry of Education, College of Chemistry
Yajing Ding
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Yuanyuan Zhao
College of Chemistry
Xinpei Jia
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Xiaoyu Ke
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Xiaoqing Sun
Junshuai Chai
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,
Xiaolei Wang
State Key Laboratory of Natural Product Chemistry, College of Chemistry and Chemical Engineering
Wenwu Wang
State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) , Beijing 100029,