Sub-100 Ω/□ sheet resistance of GaN HEMT with ScAlN barrier
Abstract
A low sheet resistance of 95.5 Ω/□ at room temperature has been demonstrated in an MBE-grown Sc0.15Al0.85N/AlN/GaN epitaxial HEMT structure. Owing to the strong spontaneous and piezoelectric polarization of ScAlN, a large two-dimensional electron gas density of 7.8 × 1013 cm−2 and a relatively high mobility of 836 cm2/V·s were demonstrated with a 15 nm Sc0.15Al0.85N barrier. Further investigation under low temperature on this structure reveals a reduced sheet resistance to 33.3 Ω/□ and mobility increased to 4223 cm2/V·s at 10 K. The dependence of sheet carrier density, mobility, and the associated sheet resistance on ScAlN thickness was further studied. The compelling electron transport properties demonstrated in the structure position ScAlN as a strong contender as the barrier layer in future GaN HEMT devices.
Article Details
Journal Info
Applied Physics Letters
American Institute of Physics
Authors (11)
Jiangnan Liu
Pat Kezer
Department of Electrical Engineering and Computer Science, University of Michigan 1 , Ann Arbor, Michigan 48109,
Md Tanvir Hasan
Ding Wang
Shubham Mondal
Md Mehedi Hasan Tanim
Jie Zhang
Danhao Wang
Kai Sun
John Heron
Department of Materials Science and Engineering, University of Michigan 2 , Ann Arbor, Michigan 48109,
Zetian Mi