Sub-100 Ω/□ sheet resistance of GaN HEMT with ScAlN barrier

J Jiangnan Liu P Pat Kezer (Department of Electrical Engineering and Computer Science, University of Michigan 1 , Ann Arbor, Michigan 48109,) M Md Tanvir Hasan D Ding Wang S Shubham Mondal M Md Mehedi Hasan Tanim J Jie Zhang D Danhao Wang K Kai Sun J John Heron (Department of Materials Science and Engineering, University of Michigan 2 , Ann Arbor, Michigan 48109,) Z Zetian Mi

Abstract

A low sheet resistance of 95.5 Ω/□ at room temperature has been demonstrated in an MBE-grown Sc0.15Al0.85N/AlN/GaN epitaxial HEMT structure. Owing to the strong spontaneous and piezoelectric polarization of ScAlN, a large two-dimensional electron gas density of 7.8 × 1013 cm−2 and a relatively high mobility of 836 cm2/V·s were demonstrated with a 15 nm Sc0.15Al0.85N barrier. Further investigation under low temperature on this structure reveals a reduced sheet resistance to 33.3 Ω/□ and mobility increased to 4223 cm2/V·s at 10 K. The dependence of sheet carrier density, mobility, and the associated sheet resistance on ScAlN thickness was further studied. The compelling electron transport properties demonstrated in the structure position ScAlN as a strong contender as the barrier layer in future GaN HEMT devices.

Article Details

Volume / Issue Vol. 127, Issue 5
Published August 04, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (11)

J

Jiangnan Liu

P

Pat Kezer

Department of Electrical Engineering and Computer Science, University of Michigan 1 , Ann Arbor, Michigan 48109,

M

Md Tanvir Hasan

D

Ding Wang

S

Shubham Mondal

M

Md Mehedi Hasan Tanim

J

Jie Zhang

D

Danhao Wang

K

Kai Sun

J

John Heron

Department of Materials Science and Engineering, University of Michigan 2 , Ann Arbor, Michigan 48109,

Z

Zetian Mi