Size effects and temperature dependence in the thermal conductivity of γ-Ga2O3 films

S Seungwon Park (Department of Mechanical Engineering, Carnegie Mellon University 1 , Pittsburgh, Pennsylvania 15213,) Y Yuxing Liang (Department of Mechanical Engineering, Carnegie Mellon University 1 , Pittsburgh, Pennsylvania 15213,) J Jingyu Tang (Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,) K Kunyao Jiang (Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,) A Abhishek Pathak R Robert F. Davis (Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,) L Lisa M. Porter (Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,) J Jonathan A. Malen (Department of Mechanical Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,)

Abstract

The thermal conductivities of (100) γ-Ga2O3 films deposited on (100) MgAl2O4 substrates with various thicknesses were measured using frequency-domain thermoreflectance. The measured thermal conductivities of γ-Ga2O3 films are lower than the thermal conductivities of (2¯ 01) β-Ga2O3 films of comparable thickness, which suggests that γ-phase inclusions in the doped or alloyed β-phase may affect its thermal conductivity. The thermal conductivity of γ-Ga2O3 increases from 2.3−0.5+0.9 to 3.5±0.7 W/m K for films with thicknesses of 75–404 nm, which demonstrates a prominent size effect on thermal conductivity. The thermal conductivity of γ-Ga2O3 also shows a slight increase as temperature increases from 293 to 400 K. This increase in thermal conductivity occurs when defect and boundary scattering suppress signatures of temperature-dependent Umklapp scattering. γ-Ga2O3 has a cation-defective spinel structure with at least two gallium vacancies in every unit cell, which are the likely source of defect scattering.

Article Details

Volume / Issue Vol. 126, Issue 23
Published June 09, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

S

Seungwon Park

Department of Mechanical Engineering, Carnegie Mellon University 1 , Pittsburgh, Pennsylvania 15213,

Y

Yuxing Liang

Department of Mechanical Engineering, Carnegie Mellon University 1 , Pittsburgh, Pennsylvania 15213,

J

Jingyu Tang

Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,

K

Kunyao Jiang

Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,

A

Abhishek Pathak

R

Robert F. Davis

Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,

L

Lisa M. Porter

Department of Materials Science and Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,

J

Jonathan A. Malen

Department of Mechanical Engineering, Carnegie Mellon University , Pittsburgh, Pennsylvania 15213,