Single-event burnout in <i>β</i>-Ga2O3 Schottky barrier diode induced by heavy ion irradiation

T Teng Ma X Xing Li (Interdisciplinary Science Center, State Key Laboratory of Animal Biodiversity Conservation and Integrated Pest Management, Institute of Zoology) S Silei Zhong (China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 510610,) Y Yahui Feng Y Yuangang Wang (The National Key Laboratory of Solid-State Microwave Devices and Circuits, Hebei Semiconductor Research Institute 3 , Shijiazhuang 050051,) X Xiaoning Zhang C Chao Peng H Hong Zhang Z Zhangang Zhang (China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 510610,) X Xiaowen Liang Z Zhifeng Lei (China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 510610,)

Abstract

This study investigates single-event burnout (SEB) effects in β-Ga2O3 Schottky barrier diodes under heavy ion irradiation. Bi, Ta, and Kr ions with linear energy transfer (LET) values of 99.7, 75, and 37 MeV/(mg·cm2), respectively, were used in the experiments. The results show that the SEB threshold voltage decreases with increasing LET, indicating a strong dependence on energy deposition. In addition, reverse bias is identified as a critical triggering condition for SEB, which occurs only when the applied voltage is high enough to initiate thermal runaway and cause irreversible damage. To further elucidate the failure mechanism, Kr ions were selected for detailed investigation. technology computer-aided design simulations combined with scanning electron microscopy-based failure analysis revealed that transient current surges can rapidly elevate the local temperature. Once the temperature reaches the melting point of Ga2O3 material, SEB is triggered by irreversible thermal failure. Moreover, the failure sites were primarily located at the edge of the Schottky junction, indicating structural vulnerability in this region. These findings clarify the LET and reverse bias dependence of SEB in ultra-wide bandgap devices and provide insights into radiation-hardened design.

Article Details

Volume / Issue Vol. 127, Issue 12
Published September 22, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (11)

T

Teng Ma

X

Xing Li

Interdisciplinary Science Center, State Key Laboratory of Animal Biodiversity Conservation and Integrated Pest Management, Institute of Zoology

S

Silei Zhong

China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 510610,

Y

Yahui Feng

Y

Yuangang Wang

The National Key Laboratory of Solid-State Microwave Devices and Circuits, Hebei Semiconductor Research Institute 3 , Shijiazhuang 050051,

X

Xiaoning Zhang

C

Chao Peng

H

Hong Zhang

Z

Zhangang Zhang

China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 510610,

X

Xiaowen Liang

Z

Zhifeng Lei

China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 510610,