Shear-strain-dependent thermal conductivity of diamond explored via a machine learning potential
Abstract
Diamond is regarded as a critical material for the thermal management of high-power electronics. However, the impact of shear strain, which is a prevalent deformation mode in complex stress fields, remains unclear. In this work, the lattice thermal conductivity of diamond under shear strain has been systematically investigated using high-accuracy neuroevolution potential and homogeneous non-equilibrium molecular dynamics. Distinct from isotropic or uniaxial strain cases, shear strain induces pronounced threshold effects and strong anisotropy. Beyond a critical shear strain of 0.01, the thermal conductivity exhibits a sharp decay, with the reduction along the [001] direction (perpendicular to the (001) shear plane) being markedly greater than that along the [100] and [010] directions (parallel to the (001) shear plane). This anisotropy is attributed to a distinct phonon frequency shift compensation mechanism. Along the [100] and [010] directions (parallel to the shear plane), a phonon redshift drives high-frequency modes into the 10–30 THz range critical for thermal transport, thereby partially compensating for scattering-induced losses. Consequently, it can be concluded that the microscopic origins of strain-dependent thermal transport provide further theoretical insights into the thermal management of electronic devices employing diamond heat spreaders under complex stress fields.
Article Details
Journal Info
Applied Physics Letters
American Institute of Physics
Authors (9)
Shijie Guo
Qijun Wang
School of Integrated Circuits, Wuhan University 1 , Wuhan 430072,
Zijun Qi
School of Integrated Circuits, Wuhan University 1 , Wuhan 430072,
Zhanpeng Sun
School of Integrated Circuits, Wuhan University 1 , Wuhan 430072,
Jingyuan Ni
College of Liberal Arts & Sciences, University of Illinois Urbana-Champaign 5 , Champaign, Illinois 61820,
Bingkun Chen
School of Integrated Circuits, Wuhan University 1 , Wuhan 430072,
Rui Li
Wei Shen
Gai Wu
School of Integrated Circuits, Wuhan University 1 , Wuhan 430072,