Regrown n++-GaN ohmic contacts to high-Al content AlxGa1−xN (x > 0.6) digital alloy channels using AlN/GaN short-period superlattice

T Tariq Jamil (Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,) A Abdullah Al Mamun Mazumder (Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,) S S M Tazbiul Hasan (Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,) M Mafruda Rahman (Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,) M Muhammad Ali A Ankit Malik (Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,) K Kamal Hussain (Texas Instruments Incorporated 2 , Dallas, Texas 75243,) C Chandan Joishi (Analog Devices Incorporated 3 , Boston, Massachusetts 02110,) M Mansura Sadek (Analog Devices Incorporated 3 , Boston, Massachusetts 02110,) J James G. Fiorenza (Analog Devices Incorporated 3 , Boston, Massachusetts 02110,) G Grigory Simin (Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,) A Asif Khan

Abstract

In this paper, we report a novel ohmic contact formation scheme for extreme bandgap AlxGa1−xN (x > 0.6) channel high electron mobility transistors with undoped barrier layers. Our approach consists of using a new low-temperature pulsed metal-organic chemical vapor deposition doping scheme for the n++-GaN regrown contacts and an AlxGa1−xN digital alloy (DA) channel layer comprising short-period superlattices of AlN and GaN. Pulsed growth and doping yield a sheet resistivity that is a factor of 3–5 lower than that of conventional doped n++-GaN layers grown under identical conditions. Moreover, the regrown n++-GaN layer has no hetero-barrier with the GaN layers of the DA channel, which leads to linear ohmic contacts and a record low contact resistance Rc ∼ 6.5 Ω-mm to the Al0.62Ga0.38N DA channel layer of a HEMT with an AlN barrier layer.

Article Details

Volume / Issue Vol. 129, Issue 4
Published July 27, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (12)

T

Tariq Jamil

Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,

A

Abdullah Al Mamun Mazumder

Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,

S

S M Tazbiul Hasan

Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,

M

Mafruda Rahman

Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,

M

Muhammad Ali

A

Ankit Malik

Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,

K

Kamal Hussain

Texas Instruments Incorporated 2 , Dallas, Texas 75243,

C

Chandan Joishi

Analog Devices Incorporated 3 , Boston, Massachusetts 02110,

M

Mansura Sadek

Analog Devices Incorporated 3 , Boston, Massachusetts 02110,

J

James G. Fiorenza

Analog Devices Incorporated 3 , Boston, Massachusetts 02110,

G

Grigory Simin

Department of Electrical Engineering, University of South Carolina 1 , Columbia, South Carolina 29208,

A

Asif Khan