Reconfigurable threshold voltage and excellent anti-single-event transient performance in the HfO2-based ferroelectric FlexFET

Z Zhenguo Wang Q Qiangxiang Peng (Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,) B Binjian Zeng (Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,) T Tianqi Hao (Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,) C Changfan Ju (Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,) S Shuaizhi Zheng (Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,) M Min Liao

Abstract

Ferroelectric field effect transistor (FeFET) memory, integrated with the recently discovered HfO2-based ferroelectric thin films, has attracted significant interest as a promising technology for next-generation non-volatile memory applications. In this work, we present a fully depleted silicon-on-insulator (FD-SOI) independently double-gated FeFET (Fe-FlexFET) based on Hf0.5Zr0.5O2 (HZO) ferroelectric thin film. The Fe-FlexFET provides flexible dynamic threshold voltage (VTH) control, which can not only eliminate the reliability issue of VTH shift but also be utilized to construct reconfigurable integrated circuits. Based on a technology computer-aided design numerical model, we demonstrate that the large VTH tuning capability could be efficiently achieved via increasing the HZO thickness and reducing the silicon thickness. Moreover, the Fe-FlexFET exhibits significantly improved robustness against single-event transients compared to the FD-SOI FeFET, attributed to the collection of holes and electrons at the bottom gate junction. This study paves the way for highly reliable HfO2-based FeFET memories and underscores their great potential for application in reconfigurable integrated circuits.

Article Details

Volume / Issue Vol. 128, Issue 17
Published April 27, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (7)

Z

Zhenguo Wang

Q

Qiangxiang Peng

Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,

B

Binjian Zeng

Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,

T

Tianqi Hao

Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,

C

Changfan Ju

Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,

S

Shuaizhi Zheng

Key Laboratory of Low Dimensional Materials and Application Technology of Ministry of Education, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,

M

Min Liao