Phase engineering of κ-Ga2O3 heteroepitaxy on LiNbO3 by strain competition effect

S Songhao Gu (School of Electronic Science and Engineering, Nanjing University , Nanjing 210023,) M Mei Cui (School of Electronic Science and Engineering, Nanjing University , Nanjing 210023,) R Rongming Yin (School of Electronic Science and Engineering, Nanjing University , Nanjing 210023,) F Fang-fang Ren (School of Electronic Science and Engineering, Nanjing University 2 , Nanjing 210023,) S Shulin Gu (School of Electronic Science and Engineering, Nanjing University 2 , Nanjing 210023,) R Rong Zhang (Department of Materials Science and Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong 999077, China) J Jiandong Ye (School of Electronic Science and Engineering, Nanjing University 2 , Nanjing 210023,)

Abstract

Phase engineering through strain modulation has emerged as an effective strategy for tailoring the properties of polymorphic oxide semiconductors. This study demonstrates the heteroepitaxial growth of orthorhombic κ-Ga2O3 on LiNbO3, focusing on phase engineering via strain competition between thermal expansion and lattice mismatch. By varying the growth temperature from 510 to 590 °C, the in-plane strain in κ-Ga2O3 was tuned from tensile (+0.16%) to compressive (−0.17%). High-resolution x-ray diffraction and transmission electron microscopy revealed that elevated temperatures induce compressive strain, suppressing the formation of a thick γ-Ga2O3 transition layer and enabling atomically sharp interfaces between the κ- and γ-Ga2O3. This strain engineering significantly improves film crystallinity, reduces domain twisting disorder, and improves interfacial quality. Atomic-scale analyses via high-angle annular dark-field scanning transmission electron microscopy confirmed the stacking sequences (A–B–A*–B*) and the out-of-plane inversion symmetry breaking along κ-Ga2O3 [001], establishing the structural origin of its ferroelectric polarization and laying the groundwork for polarization engineering in future ferroelectric device applications.

Article Details

Volume / Issue Vol. 127, Issue 6
Published August 11, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (7)

S

Songhao Gu

School of Electronic Science and Engineering, Nanjing University , Nanjing 210023,

M

Mei Cui

School of Electronic Science and Engineering, Nanjing University , Nanjing 210023,

R

Rongming Yin

School of Electronic Science and Engineering, Nanjing University , Nanjing 210023,

F

Fang-fang Ren

School of Electronic Science and Engineering, Nanjing University 2 , Nanjing 210023,

S

Shulin Gu

School of Electronic Science and Engineering, Nanjing University 2 , Nanjing 210023,

R

Rong Zhang

Department of Materials Science and Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong 999077, China

J

Jiandong Ye

School of Electronic Science and Engineering, Nanjing University 2 , Nanjing 210023,