Parallel 2DHG conduction in AlN/GaN/AlN HEMTs: Leakage mechanisms and electric field distribution

Y Yuke Cao (Centre for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol 1 , Tyndall Avenue, Bristol BS8 1TL,) J James W. Pomeroy (Centre for Device Thermography (CDTR), H.H. Wills Physics Laboratory, University of Bristol 1 , BS8 1TL Bristol,) A Austin Hickman (School of Electrical and Computer Engineering, Department of Material Science and Engineering, Kavli Institute, Cornell University 2 , Ithaca, New York 14853) R Reet Chaudhuri (School of Electrical and Computer Engineering, Department of Material Science and Engineering, Kavli Institute, Cornell University 2 , Ithaca, New York 14853) D Debdeep Jena (School of Electrical and Computer Engineering, Cornell University 2 , Ithaca, New York 14853,) H Huili Grace Xing (Institute of Materials and Systems for Sustainability, Nagoya University 1 , Nagoya 464-8601,) M Martin Kuball (Centre for Device Thermography (CDTR), H.H. Wills Physics Laboratory, University of Bristol 1 , BS8 1TL Bristol,)

Abstract

We provide direct evidence of two-dimensional hole gas (2DHG) conduction occurring in parallel with the two-dimensional electron gas (2DEG) channel in AlN/GaN/AlN high-electron-mobility transistors, using combined electrical characterization and electric-field-induced second harmonic generation. Anomalous OFF-state leakage and diode-like field distributions, which are also confirmed in isolation structures where the top heterostructures along with the 2DEG channel have been etched, reveal a buried leakage path mediated by the 2DHG. This leakage arises from Fowler–Nordheim tunneling with electron–hole pairs generation under the gate, which activates a vertical 2DEG–2DHG diode-like pathway, and from Poole–Frenkel transport that connects the 2DHG to the ohmic contacts. An equivalent circuit model is proposed to describe these mechanisms. The upper bound of the buried 2DHG sheet resistance is estimated to be 10 MΩ/sq, while the vertical resistance between the 2DHG and n++GaN is 35 MΩ mm. These findings provide a direct visualization and a comprehensive model of 2DHG-mediated leakage, offering design strategies to suppress parasitic conduction and improve device performance.

Article Details

Volume / Issue Vol. 128, Issue 3
Published January 19, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (7)

Y

Yuke Cao

Centre for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol 1 , Tyndall Avenue, Bristol BS8 1TL,

J

James W. Pomeroy

Centre for Device Thermography (CDTR), H.H. Wills Physics Laboratory, University of Bristol 1 , BS8 1TL Bristol,

A

Austin Hickman

School of Electrical and Computer Engineering, Department of Material Science and Engineering, Kavli Institute, Cornell University 2 , Ithaca, New York 14853

R

Reet Chaudhuri

School of Electrical and Computer Engineering, Department of Material Science and Engineering, Kavli Institute, Cornell University 2 , Ithaca, New York 14853

D

Debdeep Jena

School of Electrical and Computer Engineering, Cornell University 2 , Ithaca, New York 14853,

H

Huili Grace Xing

Institute of Materials and Systems for Sustainability, Nagoya University 1 , Nagoya 464-8601,

M

Martin Kuball

Centre for Device Thermography (CDTR), H.H. Wills Physics Laboratory, University of Bristol 1 , BS8 1TL Bristol,