Mechanically tunable Schottky diodes based on silicon microstructure arrays via flexoelectricity

K Kailu Wang (State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi'an Jiaotong University 1 , Xi'an 710049,) L Lingtong Lv (State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi'an Jiaotong University 1 , Xi'an 710049,) Q Qianqian Ma (School of Biological Sciences, Nanyang Technological University) G Gongxi Zhang (Automotive Engineering Research Institute, BYD Auto Industry Company Limited 2 , Shenzhen 518118,) S Shengping Shen (State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace Engineering, Xi’an Jiaotong University , Xi’an 710049,)

Abstract

Silicon is the most widely used semiconductor material, yet its centrosymmetric crystal structure makes seamless interaction between mechanical stimuli and electronic functionality challenging. Flexoelectricity—an electromechanical coupling inherent in all types of crystals—offers a solution by leveraging strain gradient-induced polarization to modulate electronic behavior. In this study, silicon microfabrication techniques are integrated with flexoelectricity to realize tunable Schottky diodes. Microstructure arrays fabricated on p-type silicon generate substantial strain gradients under macroscopic compression without relying on nanoscale probes. The strain gradients induce polarization at the metal–semiconductor interface, modulating the Schottky barrier height and thereby enabling mechanical tuning of the diode's electrical properties. The results herein demonstrate that macroscopic loading can effectively regulate the current–voltage (I–V) characteristics. This work bridges the gap between the flexoelectric effect and practical semiconductor applications, paving the way for next-generation smart materials and adaptive electronic devices.

Article Details

Volume / Issue Vol. 127, Issue 2
Published July 14, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (5)

K

Kailu Wang

State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi'an Jiaotong University 1 , Xi'an 710049,

L

Lingtong Lv

State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi'an Jiaotong University 1 , Xi'an 710049,

Q

Qianqian Ma

School of Biological Sciences, Nanyang Technological University

G

Gongxi Zhang

Automotive Engineering Research Institute, BYD Auto Industry Company Limited 2 , Shenzhen 518118,

S

Shengping Shen

State Key Laboratory for Strength and Vibration of Mechanical Structures, School of Aerospace Engineering, Xi’an Jiaotong University , Xi’an 710049,