Low-temperature microwave annealing stabilizes the morphotropic phase boundary in HfO2/ZrO2 superlattice heterostructures

C Chen-You Wei (College of Semiconductor Research, National Tsing Hua University 1 , Hsinchu,) Y Yu-Hong Chen T Tzu-I Kao (Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,) C Cheng-En Wu (Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,) C Chao-Wei Wu (Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,) H Heng-Jia Chang (Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,) Y Yi-Ju Yao (College of Semiconductor Research, National Tsing Hua University 1 , Hsinchu,) F Fu-Ju Hou (Taiwan Semiconductor Research Institute 3 , Hsinchu 30078,) G Guang-Li Luo (Taiwan Semiconductor Research Institute 3 , Hsinchu 30078,) Y Yung-Chun Wu (College of Semiconductor Research, National Tsing Hua University 1 , Hsinchu,)

Abstract

This study presents a method for achieving stable morphotropic phase boundary characteristics in superlattice HfO2/ZrO2 (SL-HZO)-based metal-ferroelectric-metal (MFM) capacitors using low-temperature microwave annealing (MWA) technology. Compared to conventional rapid thermal annealing, MWA-treated SL-HZO-based MFM capacitors exhibit excellent dielectric properties (κ = 51) at reduced processing temperatures. These devices also demonstrate improved reliability, including lower leakage current, higher breakdown strength, and an operational lifetime exceeding 10 years at voltages up to 2.54 V. This approach mitigates thermal budget limitations in back-end-of-line processes while enhancing device performance, offering a promising solution for advanced integrated circuit applications.

Article Details

Volume / Issue Vol. 126, Issue 23
Published June 09, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (10)

C

Chen-You Wei

College of Semiconductor Research, National Tsing Hua University 1 , Hsinchu,

Y

Yu-Hong Chen

T

Tzu-I Kao

Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,

C

Cheng-En Wu

Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,

C

Chao-Wei Wu

Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,

H

Heng-Jia Chang

Department of Engineering and System Science, National Tsing Hua University 2 , Hsinchu,

Y

Yi-Ju Yao

College of Semiconductor Research, National Tsing Hua University 1 , Hsinchu,

F

Fu-Ju Hou

Taiwan Semiconductor Research Institute 3 , Hsinchu 30078,

G

Guang-Li Luo

Taiwan Semiconductor Research Institute 3 , Hsinchu 30078,

Y

Yung-Chun Wu

College of Semiconductor Research, National Tsing Hua University 1 , Hsinchu,