Influence of dislocation clusters on homoepitaxial layers grown by halide vapor phase epitaxy (001) β-Ga2O3 investigated by synchrotron x-ray topography and scanning transmission electron microscopy

S Sayleap Sdoeung (Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,) K Kohei Sasaki (Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,) C Chia-Hung Lin M Mohan Rajesh (Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,) T Tomoka Nishikawa (Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,) A Akito Kuramata (Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,)

Abstract

Pit formation on the as-grown halide vapor phase epitaxy (001) β-Ga2O3 surface was primarily attributed to dislocation clusters in the substrate. Cross-sectional x-ray topography showed that these clusters penetrate to a minimum measured depths of roughly 210 μm below the (001) surface. Etch pit formation of the dislocation cluster revealed a distinctive type of etch pits, where the main etch pits are accompanied by smaller etch pits aligned at angles of approximately ±38° relative to the [010] direction near the head of primary etch pit. Further analysis by cross-sectional scanning electron microscopy observation confirmed that these smaller pits arise from (10¯2¯5) and (10¯25) stacking faults, which are speculated to serve as propagation paths for the dislocation clusters.

Article Details

Volume / Issue Vol. 128, Issue 18
Published May 04, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (6)

S

Sayleap Sdoeung

Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,

K

Kohei Sasaki

Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,

C

Chia-Hung Lin

M

Mohan Rajesh

Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,

T

Tomoka Nishikawa

Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,

A

Akito Kuramata

Novel Crystal Technology, Inc. , Sayama, Saitama 350-1328,