Impact of quantum well thickness on efficiency loss in InGaN/GaN LEDs: Challenges for thin-well designs

X Xuefeng Li N Nick Pant (Department of Materials Science and Engineering, University of Michigan 1 , Ann Arbor, Michigan 48109,) S Sheikh Ifatur Rahman (Department of Electrical and Computer Engineering, The Ohio State University 4 , Columbus, Ohio 43210,) R Rob Armitage (Lumileds LLC 5 , San Jose, California 95131,) S Siddharth Rajan (Department of Electrical and Computer Engineering, Ohio State University 1 , Columbus, Ohio 43210,) E Emmanouil Kioupakis D Daniel Feezell (Center for High Technology Materials (CHTM), University of New Mexico 1 , Albuquerque, New Mexico 87106,)

Abstract

We investigate the impact of quantum well (QW) thickness on efficiency loss in c-plane InGaN/GaN LEDs using a small-signal electroluminescence technique. Multiple mechanisms related to efficiency loss are independently examined, including injection efficiency, carrier density vs current density relationship, phase space filling, quantum-confined Stark effect, and Coulomb enhancement. An optimal QW thickness of around 2.7 nm in these InGaN/GaN LEDs was determined for QWs having constant In composition. Despite improved control of deep-level defects and lower carrier density at a given current density, LEDs with thin QWs still suffer from an imbalance in enhancement effects on the radiative and intrinsic Auger–Meitner recombination coefficients. The imbalance in enhancement effects results in a decline in internal quantum efficiency and radiative efficiency with decreasing QW thickness at low current density in LEDs with QW thicknesses below 2.7 nm. We also investigate how LED modulation bandwidth varies with QW thickness, identifying the key trends and their implications for device performance.

Article Details

Volume / Issue Vol. 126, Issue 13
Published March 01, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (7)

X

Xuefeng Li

N

Nick Pant

Department of Materials Science and Engineering, University of Michigan 1 , Ann Arbor, Michigan 48109,

S

Sheikh Ifatur Rahman

Department of Electrical and Computer Engineering, The Ohio State University 4 , Columbus, Ohio 43210,

R

Rob Armitage

Lumileds LLC 5 , San Jose, California 95131,

S

Siddharth Rajan

Department of Electrical and Computer Engineering, Ohio State University 1 , Columbus, Ohio 43210,

E

Emmanouil Kioupakis

D

Daniel Feezell

Center for High Technology Materials (CHTM), University of New Mexico 1 , Albuquerque, New Mexico 87106,