High-yield growth of high-quality cubic BAs single crystals using the Bridgman method

W Wenhao Liu (Beijing Key Laboratory of Environmental Science and Engineering, School of Materials Science and Engineering) P Pawan Koirala (Department of Physics, The University of Texas at Dallas 1 , Richardson, Texas 75080,) E Evan R. Glaser (U.S. Naval Research Laboratory) H Hanlin Wu (Department of Physics, The University of Texas at Dallas 1 , Richardson, Texas 75080,) A Aswin Kondusamy (Department of Physics, The University of Texas at Dallas 3 , Richardson, Texas 75025,) N Nikhil Dhale M Mahammed S. Patel (Department of Physics, The University of Texas at Dallas 1 , Richardson, Texas 75080,) S Sam White J James C. Culbertson (Electronics Science and Technology Division, US Naval Research Laboratory 2 , Washington, DC 20375-5347,) J Jaime A. Freitas (Electronics Science and Technology Division, US Naval Research Laboratory 2 , Washington, DC 20375-5347,) B Bing Lv (Department of Physics, The University of Texas at Dallas)

Abstract

The increasing complexity of semiconductor devices fabricated from wide-bandgap and ultra-wide-bandgap materials demand advanced thermal management solutions to mitigate heat buildup, a major cause of device failure. High thermal conductivity materials are thus becoming crucial for thermal management. Cubic boron arsenide (c-BAs) has emerged as a promising candidate. However, challenges remain in synthesizing high-quality crystals with low defect concentrations, high homogeneous thermal conductivity, and high yields using the conventional chemical vapor transport method. In this study, we report the synthesis of high-yield c-BAs single crystals using the Bridgman method. The crystals exhibit high uniformity, reduced defect densities, and lower carrier concentrations as confirmed through x-ray diffraction, Raman spectroscopy, temperature-dependent photoluminescence, and electrical transport measurements. Our work represents a significant step toward scalable production of high-quality c-BAs for industrial applications, offering a practical solution for improving thermal management in next-generation electronic devices.

Article Details

Volume / Issue Vol. 126, Issue 8
Published February 24, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (11)

W

Wenhao Liu

Beijing Key Laboratory of Environmental Science and Engineering, School of Materials Science and Engineering

P

Pawan Koirala

Department of Physics, The University of Texas at Dallas 1 , Richardson, Texas 75080,

E

Evan R. Glaser

U.S. Naval Research Laboratory

H

Hanlin Wu

Department of Physics, The University of Texas at Dallas 1 , Richardson, Texas 75080,

A

Aswin Kondusamy

Department of Physics, The University of Texas at Dallas 3 , Richardson, Texas 75025,

N

Nikhil Dhale

M

Mahammed S. Patel

Department of Physics, The University of Texas at Dallas 1 , Richardson, Texas 75080,

S

Sam White

J

James C. Culbertson

Electronics Science and Technology Division, US Naval Research Laboratory 2 , Washington, DC 20375-5347,

J

Jaime A. Freitas

Electronics Science and Technology Division, US Naval Research Laboratory 2 , Washington, DC 20375-5347,

B

Bing Lv

Department of Physics, The University of Texas at Dallas