High-thermal-conductivity polycrystalline diamond grown on GaN via a cyclic-methane-modulation-assisted strategy

Y Yutao Fang (College of Smart Materials and Future Energy, Fudan University 1 , Shanghai 200433,) Y Yabing Li Z Ziling Cai (College of Smart Materials and Future Energy, Fudan University 1 , Shanghai 200433,) T Tiantian Luan (Institute of Optoelectronics, College of Future Information Technology, Fudan University 2 , Shanghai 200433,) B Bocong Zou (Institute of Optoelectronics, College of Future Information Technology, Fudan University 2 , Shanghai 200433,) Y Yumeng Zhou Y Yaqi Hou (Institute of Optoelectronics, College of Future Information Technology, Fudan University 2 , Shanghai 200433,) L Liwen Sang (College of Smart Materials and Future Energy, Fudan University 1 , Shanghai 200433,)

Abstract

The self-heating effect severely limits the performance and reliability of GaN high-electron-mobility transistors (HEMTs). Direct deposition of thin-film polycrystalline diamond (PCD) on GaN is regarded as a promising strategy as it allows the heat spreader to be placed as close as possible to the hotspots. However, rapid grain coalescence during the initial growth stage usually leads to the formation of high-density graphitic carbon phases, which significantly degrades the thermal conductivity (k) of the as-grown diamond films. Here, we report a cyclic-methane-modulation-assisted (CMMA) two-step growth strategy with periodically cycled methane concentration that balances the growth rate and grain quality while suppressing the incorporation of graphite. This approach achieves a remarkably high k of 632 ± 76 W/m K for 2.4-μm-thick PCD on GaN, accompanied by a low thermal boundary resistance of 8.5 ± 0.5 m2 K/GW even with a 5 nm-thick SiNx interlayer. Finite-element simulation predicts a 70 °C reduction in peak temperature for the HEMTs integrated with CMMA-grown diamond, which highlights its substantial potential for effective thermal dissipation in high-power electronic applications.

Article Details

Volume / Issue Vol. 129, Issue 5
Published August 03, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

Y

Yutao Fang

College of Smart Materials and Future Energy, Fudan University 1 , Shanghai 200433,

Y

Yabing Li

Z

Ziling Cai

College of Smart Materials and Future Energy, Fudan University 1 , Shanghai 200433,

T

Tiantian Luan

Institute of Optoelectronics, College of Future Information Technology, Fudan University 2 , Shanghai 200433,

B

Bocong Zou

Institute of Optoelectronics, College of Future Information Technology, Fudan University 2 , Shanghai 200433,

Y

Yumeng Zhou

Y

Yaqi Hou

Institute of Optoelectronics, College of Future Information Technology, Fudan University 2 , Shanghai 200433,

L

Liwen Sang

College of Smart Materials and Future Energy, Fudan University 1 , Shanghai 200433,