High thermal conductivity of rutile-GeO2 film by metal-organic chemical vapor deposition: 52.9 W m−1 K−1

I Imteaz Rahaman (Department of Electrical and Computer Engineering, University of Utah 1 , Salt Lake City, Utah 84112,) M Michael E. Liao (Apex Microdevices 2 , West Chester, Ohio 45069,) Z Ziqi Wang (Division of Advanced Materials) E Eugene Y. Kwon (Department of Materials Science and Engineering, University of California 3 , Los Angeles, California 90095,) R Rui Sun B Botong Li H Hunter D. Ellis (Department of Electrical and Computer Engineering, The University of Utah 1 , Salt Lake City, Utah 84112,) B Bobby G. Duersch D Dali Sun J Jun Liu M Mark S. Goorsky (Department of Materials Science and Engineering, University of California 3 , Los Angeles, California 90095,) M Michael A. Scarpulla (Department of Electrical and Computer Engineering, The University of Utah 1 , Salt Lake City, Utah 84112,) K Kai Fu (State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, School of Materials Science and Engineering)

Abstract

Rutile germanium dioxide (r-GeO2) has recently emerged as a promising ultrawide-bandgap (UWBG) semiconductor owing to its wide bandgap (∼4.4–5.1 eV), ambipolar doping potential, and high theoretical thermal conductivity. However, experimental data on the thermal conductivity of r-GeO2 epitaxial layers have not been reported, primarily due to challenges in phase control and surface roughness. Here, we report a high thermal conductivity of 52.9 ± 6.6 W m−1 K−1 for high-quality (002) r-GeO2 films grown by metal-organic chemical vapor deposition and characterized using time-domain thermoreflectance. The phase control was achieved through a seed-driven stepwise crystallization approach, and the surface roughness was significantly reduced from 76 to 16 nm (locally as low as 1 Å) via chemical mechanical polishing. These results highlight the promise of r-GeO2 as a UWBG oxide platform for power electronics applications.

Article Details

Volume / Issue Vol. 128, Issue 8
Published February 23, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (13)

I

Imteaz Rahaman

Department of Electrical and Computer Engineering, University of Utah 1 , Salt Lake City, Utah 84112,

M

Michael E. Liao

Apex Microdevices 2 , West Chester, Ohio 45069,

Z

Ziqi Wang

Division of Advanced Materials

E

Eugene Y. Kwon

Department of Materials Science and Engineering, University of California 3 , Los Angeles, California 90095,

R

Rui Sun

B

Botong Li

H

Hunter D. Ellis

Department of Electrical and Computer Engineering, The University of Utah 1 , Salt Lake City, Utah 84112,

B

Bobby G. Duersch

D

Dali Sun

J

Jun Liu

M

Mark S. Goorsky

Department of Materials Science and Engineering, University of California 3 , Los Angeles, California 90095,

M

Michael A. Scarpulla

Department of Electrical and Computer Engineering, The University of Utah 1 , Salt Lake City, Utah 84112,

K

Kai Fu

State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, School of Materials Science and Engineering