High-energy density in dielectric film capacitors via interface engineering and polarization behavior regulation

Y Yupeng Liu T Tian-Yi Hu (State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science and Engineering, Xi'an Jiaotong University 1 , Xi'an 710049,) L Lu Lu Y Yiqin Lu (School of Microelectronics, Xi'an Jiaotong University 2 , Xi'an 710049,) Q Qiuyang Han (School of Microelectronics, Xi'an Jiaotong University 2 , Xi'an 710049,) W Weijie Fu T Tingzhi Duan (School of Microelectronics, Xi'an Jiaotong University 2 , Xi'an 710049,) H Hu ge M Ming Liu C Chunrui Ma (State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science and Engineering, Xi'an Jiaotong University 3 , Xi'an 710049,) S Shao-Bo Mi (Ji Hua Laboratory 3 , Foshan 528200,)

Abstract

High-performance dielectric film capacitors are crucial for energy storage applications and the modern electronics industry due to their high power density and ultra-fast charge–discharge speed. Herein, we report that high dielectric constant/high polarization coupled with low loss/low leakage characteristics has been achieved by optimizing the ratio of homogeneous/heterogeneous interfaces and paraelectric/ferroelectric phase within a sandwich structure of ferroelectric 0.85BaTiO3–0.15Bi(Mg0.5Zr0.5)O3 (BT-BMZ) and paraelectric SrTiO3 (STO) multilayer prepared on (110)-oriented 0.7 wt. % Nb-doped SrTiO3 (Nb:STO) substrates. The optimized sandwich structure of ferroelectric/paraelectric/ferroelectric film reaches an energy storage density of ∼124.15 J/cm3 with an efficiency of ∼74.6% at room temperature. In addition, the film exhibits excellent thermal stability over a wide temperature range from −100 to 300 °C while maintaining a high-energy storage density (e.g., ∼73.8 J/cm3 with an efficiency of ∼77.6% at 300 °C) due to its low leakage current and hysteresis loss. Our work demonstrates the feasibility and effectiveness of optimized sandwich structures in improving energy storage performance, providing a pathway for the design of high-performance film capacitors.

Article Details

Volume / Issue Vol. 128, Issue 4
Published January 26, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (11)

Y

Yupeng Liu

T

Tian-Yi Hu

State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science and Engineering, Xi'an Jiaotong University 1 , Xi'an 710049,

L

Lu Lu

Y

Yiqin Lu

School of Microelectronics, Xi'an Jiaotong University 2 , Xi'an 710049,

Q

Qiuyang Han

School of Microelectronics, Xi'an Jiaotong University 2 , Xi'an 710049,

W

Weijie Fu

T

Tingzhi Duan

School of Microelectronics, Xi'an Jiaotong University 2 , Xi'an 710049,

H

Hu ge

M

Ming Liu

C

Chunrui Ma

State Key Laboratory for Mechanical Behavior of Materials and School of Materials Science and Engineering, Xi'an Jiaotong University 3 , Xi'an 710049,

S

Shao-Bo Mi

Ji Hua Laboratory 3 , Foshan 528200,