HfSe2(1-X)Te2X alloy channel transistor with semimetal HfTe2 contact electrodes

Y Yuxiang Wang (Key Laboratory of Photochemical Conversion and Optoelectronic Materials & CAS-HKU Joint Laboratory on New Materials) B Boyuan Di (State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) Y Yijia Jiang (State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) J Jie Yu S Shiwan Zou (State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) L Liqiang Chen (State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) S Shijie Liu Z Ziyi Dong J Jintian Li (State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,) H Haixin Chang W Wenfeng Zhang

Abstract

We have demonstrated series ternary HfSe2(1-x)Te2x single crystalline alloys can be synthesized by a general chemical vapor transport approach. These alloys were verified to exhibit composition-dependent bandgap tunability (from 1.1 to 0 eV) by growth process control. Such characteristic offers a feasible way to construct HfSe2(1-x)Te2x alloy channel transistors using Dirac semimetal HfTe2 as contact electrodes, which shows negligible Schottky barrier height. Notably, the HfSe1.8Te0.2 channel transistor with a channel length of 9.48 μm on a 14 nm h-BN dielectric achieves a balance performance with current Ion/Ioff ratio of 9.5 × 104 and an Ion of 0.828 μA/μm. The current investigation of alloy engineering offers a feasible way of developing high-performance HfSe2-based beyond-silicon electronics.

Article Details

Volume / Issue Vol. 127, Issue 22
Published December 01, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (11)

Y

Yuxiang Wang

Key Laboratory of Photochemical Conversion and Optoelectronic Materials & CAS-HKU Joint Laboratory on New Materials

B

Boyuan Di

State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

Y

Yijia Jiang

State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

J

Jie Yu

S

Shiwan Zou

State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

L

Liqiang Chen

State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

S

Shijie Liu

Z

Ziyi Dong

J

Jintian Li

State Key Laboratory of Material Processing and Die and Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,

H

Haixin Chang

W

Wenfeng Zhang