Graphene-based thermal interface materials with high through-plane thermal conductivity inspired by Baumkuchen

Abstract

To enhance the thermal management capabilities of epoxy composite, inspired by Baumkuchen, a simple, scalable, and environmentally friendly process was proposed. The graphene strips, without any chemical modification, were integrated into assembled graphene paper, and the vertically aligned graphene strips/epoxy composite with the tree-ring structure was prepared by the rolling cutting method. The composite exhibited an extremely high through-plane thermal conductivity of 49.2 W/mK, which was 289 times higher than that of pure EP. Additionally, the composite also possesses a range of desirable properties, including good electromagnetic interference shielding, efficient Joule heating, and remarkable mechanical performance. These properties further expand the application of graphene-based thermal interface materials in the field of thermal management of electronic devices.