Gamma-ray radiation hardness of Ir contacts in H-terminated diamond MESFETs

Y Yoonseok Nam (Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,) T Taemyung Kwak (Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,) S Seolyoung Oh (Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,) G Geunho Yoo (Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,) D Dong-Seok Kim (Korea Multi-Purpose Accelerator Complex, Korea Atomic Energy Research Institute (KAERI) 2 , 181 Mirae-ro, Geoncheon-eup, Gyeongju 38180,) S Seong-Woo Kim (Orbray Co., Ltd 3 ., 3-8-22 Shinden, Adachi-ku, Tokyo 123-8511,) O Okhyun Nam (Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,)

Abstract

We investigate the radiation hardness and electrical stability of Ir-based source and drain contacts employed in hydrogen-terminated diamond MESFETs under 100 kGy γ-ray irradiation followed by thermal annealing. The Ir/diamond interface remains electrically stable under the present combined radiation and thermal stress conditions. In contrast, γ-ray exposure induces a positive threshold voltage shift, accompanied by changes in channel conduction consistent with ionization-induced modification of the near-surface electrostatics. A statistical evaluation across multiple devices further shows that the dominant post-irradiation changes are not contact-related, but instead appear in gate-controlled parameters, including a systematic threshold voltage shift and increased variation in subthreshold characteristics after repeated annealing at 200 °C. Taken together, these results identify Ir metallization as a robust source/drain contact strategy for radiation-tolerant diamond electronics and highlight gate-stack engineering as the critical pathway for further reliability improvement.

Article Details

Volume / Issue Vol. 128, Issue 17
Published April 27, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (7)

Y

Yoonseok Nam

Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,

T

Taemyung Kwak

Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,

S

Seolyoung Oh

Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,

G

Geunho Yoo

Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,

D

Dong-Seok Kim

Korea Multi-Purpose Accelerator Complex, Korea Atomic Energy Research Institute (KAERI) 2 , 181 Mirae-ro, Geoncheon-eup, Gyeongju 38180,

S

Seong-Woo Kim

Orbray Co., Ltd 3 ., 3-8-22 Shinden, Adachi-ku, Tokyo 123-8511,

O

Okhyun Nam

Convergence Center for Advanced Nano Semiconductor, Department of Semiconductor Engineering, Tech University of Korea 1 , Sangidaehak-ro, Siheung-si, Gyeonggi-do 429-793,