Foaming-induced structural engineering of graphite arrays for high-density thermal pathways in thermal interface materials

Z Zhijun Guo Y Yuanyuan Zhang J Jianbin Mai (Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Institute of Materials Research, Tsinghua Shenzhen International Graduate School 1 , Shenzhen 518055,) Q Qingming Long (Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Institute of Materials Research, Tsinghua Shenzhen International Graduate School 1 , Shenzhen 518055,) W Wenlong Zhang W Wei Chen F Feiyu Kang H Hongda Du (Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Institute of Materials Research, Tsinghua Shenzhen International Graduate School 1 , Shenzhen 518055,)

Abstract

The escalating power density of electronics demands advanced thermal interface materials (TIMs). While graphite array-based TIMs (GRTs) have attracted considerable interest, achieving their theoretically high performance requires precise microstructural control. Structural models indicate that reducing the thickness of graphite lamellae increases the density of effective thermal pathways, which is key to enhancing GRT performance. Herein, we develop a hydrazine monohydrate-assisted foaming strategy that enables microstructural engineering of graphene oxide paper. Through systematic modulation of the hydrazine monohydrate concentration, precise control over the lamellae thickness in the derived graphite papers was achieved, which directly governs the thermal pathway density in the final GRT architecture. This structural advantage yields higher-density thermal pathways in vertical arrays, enabling the optimal GRT to achieve an ultra-low total thermal resistance of 5.7 × 10−6 m2 K W−1 and high through-plane thermal conductivity of 130.6 W m−1 K−1. This study establishes a fundamental structure–property relationship in GRTs, revealing that thermal performance is critically dependent on the architectural design of the conductive network at the micro/nanoscale. The proposed strategy offers a promising and scalable route for manufacturing advanced thermal management solutions to meet the escalating cooling demands of next-generation high-power electronics.

Article Details

Volume / Issue Vol. 128, Issue 15
Published April 13, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

Z

Zhijun Guo

Y

Yuanyuan Zhang

J

Jianbin Mai

Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Institute of Materials Research, Tsinghua Shenzhen International Graduate School 1 , Shenzhen 518055,

Q

Qingming Long

Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Institute of Materials Research, Tsinghua Shenzhen International Graduate School 1 , Shenzhen 518055,

W

Wenlong Zhang

W

Wei Chen

F

Feiyu Kang

H

Hongda Du

Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Institute of Materials Research, Tsinghua Shenzhen International Graduate School 1 , Shenzhen 518055,