Experimental and modeled analysis of source-line loading effects in NOR flash compute-in-memory arrays

T Teck-Boon Serm (Winbond Electronics Corporation 1 , Hsinchu 302052,) T Ting-Chen Chen (Department of Electrical Engineering, National Cheng Kung University 2 , Tainan,) P Ping-Kun Wang (Winbond Electronics Corporation 1 , Hsinchu 302052,) Y Yi-Der Wu (Winbond Electronics Corporation 1 , Hsinchu 302052,) T Ton-Yan Chan (Winbond Electronics Corporation 1 , Hsinchu 302052,) M Meng-Hsueh Chiang (Department of Electrical Engineering, National Cheng Kung University 2 , Tainan,) Y Yu-Hsuan Ho (Winbond Electronics Corporation 1 , Hsinchu 302052,)

Abstract

We investigate the fundamental electrical mechanisms driving non-ideal current behavior in NOR flash-based compute-in-memory (CIM) arrays. Measurements from an industrial 45 nm NOR flash process identify loading effects as the dominant degradation source. Unlike the conventional view that attributes loading primarily to bit-line voltage drop, we show it is more strongly governed by source-line voltage elevation from cumulative column current, leading to exponential drain current suppression consistent with subthreshold MOSFET theory. Experiments on a 64-cell test array confirm the model, revealing position-dependent current attenuation exceeding 40% under high-load conditions. These results directly link device-level physics to array-level performance limits, offering quantitative design guidelines for optimizing interconnect resistance, device parameters, and operating conditions in low-power CIM architectures for embedded artificial intelligence.

Article Details

Volume / Issue Vol. 127, Issue 20
Published November 17, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (7)

T

Teck-Boon Serm

Winbond Electronics Corporation 1 , Hsinchu 302052,

T

Ting-Chen Chen

Department of Electrical Engineering, National Cheng Kung University 2 , Tainan,

P

Ping-Kun Wang

Winbond Electronics Corporation 1 , Hsinchu 302052,

Y

Yi-Der Wu

Winbond Electronics Corporation 1 , Hsinchu 302052,

T

Ton-Yan Chan

Winbond Electronics Corporation 1 , Hsinchu 302052,

M

Meng-Hsueh Chiang

Department of Electrical Engineering, National Cheng Kung University 2 , Tainan,

Y

Yu-Hsuan Ho

Winbond Electronics Corporation 1 , Hsinchu 302052,