Enhanced transport properties in GaN heterostructures with sputter-epitaxy-grown ScAlN barriers via thermal annealing

T Tomoya Okuda (Department of Materials Science and Technology, Tokyo University of Science 1 , Tokyo 125-8585,) S Shunsuke Ota (Department of Materials Science and Technology, Tokyo University of Science 1 , Tokyo 125-8585,) K Kouei Kubota (Department of Electrical Engineering and Information Systems, The University of Tokyo 1 , 7-3-1, Hongo, Bunkyo, Tokyo 113-8656,) Y Yusuke Wakamoto (Department of Electrical Engineering and Information Systems, The University of Tokyo 1 , Bunkyo, Tokyo 113-8656,) S Shinsuke Hashimoto (Institute of Engineering Innovation, School of Engineering, The University of Tokyo 3 , Tokyo 113-8656,) T Takehito Seki S Satoko Toyama (Institute of Engineering Innovation, School of Engineering, The University of Tokyo 2 , Tokyo 113-8656,) N Naoya Shibata (Institute of Engineering Innovation, School of Engineering) T Takahiko Kawahara (Transmission Devices Laboratory, Sumitomo Electric Industries Ltd 4 ., Yokohama 244-8588,) K Kozo Makiyama (Transmission Devices Laboratory, Sumitomo Electric Industries Ltd 4 ., Yokohama 244-8588,) K Ken Nakata K Kazuhisa Ikeda (Department of Materials Science and Technology, Tokyo University of Science 1 , Tokyo 125-8585,) T Takuya Maeda A Atsushi Kobayashi (Department of Chemistry Faculty of Science Hokkaido University Sapporo Hokkaido Japan)

Abstract

ScAlN has attracted considerable attention as a promising barrier material in GaN-based high-electron-mobility transistors. However, few studies have been conducted on the effect of thermal annealing on the structural, electrical, and transport properties of ScAlN barrier layer sputter-deposited on an AlGaN/AlN/GaN heterostructure. Therefore, in this study, ScAlN barrier layers were grown by sputter epitaxy on templates prepared via metalorganic vapor phase deposition. Post-deposition annealing was conducted at 750 °C, which preserved the wurtzite structure of the ScAlN films and maintained coherent interfaces without interdiffusion or phase change. Hall effect measurements revealed that annealing substantially increased the sheet carrier concentration (∼8.0×1012cm−2) and electron mobility exceeding 1000 cm2 V−1 s−1 of the heterostructure. The mobility was limited by acoustic deformation potential, polar optical phonon, and interface roughness scattering. Notably, the increased roughness scattering at higher Sc content might be due to local compositional fluctuations. These results demonstrate that thermal annealing effectively enhances the transport properties of ScAlN barrier layers sputter-deposited on GaN-based heterostructures, offering a promising route for fabricating high-performance and scalable GaN-based electronic devices.

Article Details

Volume / Issue Vol. 127, Issue 18
Published November 03, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (14)

T

Tomoya Okuda

Department of Materials Science and Technology, Tokyo University of Science 1 , Tokyo 125-8585,

S

Shunsuke Ota

Department of Materials Science and Technology, Tokyo University of Science 1 , Tokyo 125-8585,

K

Kouei Kubota

Department of Electrical Engineering and Information Systems, The University of Tokyo 1 , 7-3-1, Hongo, Bunkyo, Tokyo 113-8656,

Y

Yusuke Wakamoto

Department of Electrical Engineering and Information Systems, The University of Tokyo 1 , Bunkyo, Tokyo 113-8656,

S

Shinsuke Hashimoto

Institute of Engineering Innovation, School of Engineering, The University of Tokyo 3 , Tokyo 113-8656,

T

Takehito Seki

S

Satoko Toyama

Institute of Engineering Innovation, School of Engineering, The University of Tokyo 2 , Tokyo 113-8656,

N

Naoya Shibata

Institute of Engineering Innovation, School of Engineering

T

Takahiko Kawahara

Transmission Devices Laboratory, Sumitomo Electric Industries Ltd 4 ., Yokohama 244-8588,

K

Kozo Makiyama

Transmission Devices Laboratory, Sumitomo Electric Industries Ltd 4 ., Yokohama 244-8588,

K

Ken Nakata

K

Kazuhisa Ikeda

Department of Materials Science and Technology, Tokyo University of Science 1 , Tokyo 125-8585,

T

Takuya Maeda

A

Atsushi Kobayashi

Department of Chemistry Faculty of Science Hokkaido University Sapporo Hokkaido Japan