Enhanced thermoelectric performance in AgSbTe2 with extremely low thermal conductivity via grain boundary defects

K Kaiqi Zhang J Jing Wang (Hunan Cancer Hospital Changsha China) S Shuang Liu (Frontiers Science Center for Transformative Molecules, State Key Laboratory of Polyolefins and Catalysis, School of Chemistry and Chemical Engineering) X Xiao Ji (School of Optical and Electronic Information-Wuhan National Laboratory for Optoelectronics) C Chenhao Gao (Chongqing Key Laboratory of Interface Physics in Energy Conversion and College of Physics, Chongqing University 1 , Chongqing 401331,) B Bin Zhang G Guiwen Wang (Analytical and Testing Center, Chongqing University 3 , Chongqing 401331,) G Guoyu Wang Y Yuqing Wang Y Yun Zhou H Honghui Wang X Xu Lu (Department of Pharmacognosy, State Key Laboratory of Natural Medicines, School of Traditional Chinese Pharmacy, China Pharmaceutical University) X Xiaoyuan Zhou (College of Physics and Institute of Advanced Interdisciplinary Studies)

Abstract

A delicate balance between high electrical conductivity and ultra-low glass-like thermal conductivity is critical for enhancing thermoelectric performance. Here, by introducing grain boundary trapping states into the AgSbTe2 matrix, the thermally activated release of carriers at elevated temperatures enhances electrical conductivity, while the increased barrier potential induces an energy filtering effect that sustains a high Seebeck coefficient. This synergistic optimization of electrical conductivity and Seebeck coefficient significantly enhances the power factor. Additionally, numerous point defects and a higher density of grain boundaries further enhance phonon scattering, resulting in a 33% reduction in glass-like thermal conductivity compared to the pristine sample. With enhanced power factor and reduced lattice thermal conductivity, Fe-doped AgSbTe2 achieves a remarkable peak zT of 1.8 at 623 K and an impressive zTavg of 1.4 over the temperature range of 323–623 K, showcasing its leading performance in the field. By selecting proper contact layer materials with matched thermal expansion coefficients, low interfacial resistivity was achieved, enabling a single-leg thermoelectric device with ∼10% efficiency under a 323 K temperature difference.

Article Details

Volume / Issue Vol. 126, Issue 8
Published February 01, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (13)

K

Kaiqi Zhang

J

Jing Wang

Hunan Cancer Hospital Changsha China

S

Shuang Liu

Frontiers Science Center for Transformative Molecules, State Key Laboratory of Polyolefins and Catalysis, School of Chemistry and Chemical Engineering

X

Xiao Ji

School of Optical and Electronic Information-Wuhan National Laboratory for Optoelectronics

C

Chenhao Gao

Chongqing Key Laboratory of Interface Physics in Energy Conversion and College of Physics, Chongqing University 1 , Chongqing 401331,

B

Bin Zhang

G

Guiwen Wang

Analytical and Testing Center, Chongqing University 3 , Chongqing 401331,

G

Guoyu Wang

Y

Yuqing Wang

Y

Yun Zhou

H

Honghui Wang

X

Xu Lu

Department of Pharmacognosy, State Key Laboratory of Natural Medicines, School of Traditional Chinese Pharmacy, China Pharmaceutical University

X

Xiaoyuan Zhou

College of Physics and Institute of Advanced Interdisciplinary Studies