Electron drift velocity measurement of AlGaN/GaN single- and multi-channel Fin structures

Q Qingru Wang (School of Nano-Tech and Nano-Bionics, University of Science and Technology of China 1 , Hefei 230026,) Q Quan Dai (Key Laboratory of Semiconductor Display Materials and Chips, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences 1 , Suzhou 215123,) X Xinkun Zhang (Key Laboratory of Semiconductor Display Materials and Chips, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences 2 , Suzhou 215123,) Y Yu Zhou X Xiaoning Zhan (Beijing Key Laboratory for Science and Application of Functional Molecular and Crystalline Materials, Department of Chemistry and Chemical Engineering, School of Chemistry and Biological Engineering) Q Qian Li J Jianxun Liu (Key Laboratory of Semiconductor Display Materials and Chips, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences 2 , Suzhou 215123,) J Jiaanli Wang (School of Nano-Tech and Nano-Bionics, University of Science and Technology of China 1 , Hefei 230026,) C Cheng Li Q Qian Sun M Meixin Feng (School of Nano-Tech and Nano-Bionics, University of Science and Technology of China 1 , Hefei 230026,) H Hui Yang

Abstract

This paper presents a method for extracting electron drift velocity vs electric field characteristics in AlGaN/GaN Fin structures by combining Fin-Hall bar and Fin-Transmission Line Model measurements. Carrier density and Ohmic contact resistivity were independently extracted as a function of Fin width, enabling accurate calculation of internal electric field and drift velocity from pulsed I–V curves. It is revealed that the drift velocity decreases with the narrowing of Fin width due to enhanced sidewall influence, and multi-channel structures show higher drift velocity thanks to weaker interaction between electrons and longitudinal optical phonons. This measurement method provides a quantitative approach for studying carrier transport behavior under high electric field, offering a fundamental tool for Fin-based device design and modeling.

Article Details

Volume / Issue Vol. 128, Issue 15
Published April 13, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (12)

Q

Qingru Wang

School of Nano-Tech and Nano-Bionics, University of Science and Technology of China 1 , Hefei 230026,

Q

Quan Dai

Key Laboratory of Semiconductor Display Materials and Chips, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences 1 , Suzhou 215123,

X

Xinkun Zhang

Key Laboratory of Semiconductor Display Materials and Chips, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences 2 , Suzhou 215123,

Y

Yu Zhou

X

Xiaoning Zhan

Beijing Key Laboratory for Science and Application of Functional Molecular and Crystalline Materials, Department of Chemistry and Chemical Engineering, School of Chemistry and Biological Engineering

Q

Qian Li

J

Jianxun Liu

Key Laboratory of Semiconductor Display Materials and Chips, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences 2 , Suzhou 215123,

J

Jiaanli Wang

School of Nano-Tech and Nano-Bionics, University of Science and Technology of China 1 , Hefei 230026,

C

Cheng Li

Q

Qian Sun

M

Meixin Feng

School of Nano-Tech and Nano-Bionics, University of Science and Technology of China 1 , Hefei 230026,

H

Hui Yang