Efficient and anisotropic strain engineering in few-layer 3R-MoS2 via polymer encapsulation

H Haitao Hu L Liangyi Du (School of Science, Nanjing University of Posts and Telecommunications 1 , Nanjing 210023,) H Huifan Chen (School of Science, Nanjing University of Posts and Telecommunications 1 , Nanjing 210023,) L Liangliang Zhou C Caiyu Qiu (National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University 3 , Nanjing 210093,) Y Yunhui Wang (School of Science, Nanjing University of Posts and Telecommunications 1 , Nanjing 210023,) P Peng Chen Y Yanfeng Lyu

Abstract

Efficient strain transfer to few-layer two-dimensional materials remains challenging due to weak interfacial coupling. Here, we apply uniaxial tensile strain up to 4.3% to few-layer 3R-MoS2 using a polymer encapsulation approach on a flexible polyethylene terephthalate substrate. The in-plane lattice vibrations and exciton emissions exhibit pronounced anisotropic modulation efficiency. The response is strongest along the zigzag direction, yielding a maximum phonon mode splitting of 10.81 cm−1 and a bandgap modulation of 175.8 meV, values that surpass those reported for most monolayer and few-layer 2H-MoS2. This work offers a general and effective strain-engineering approach for exploring strain modulation in other few-layer two-dimensional materials.

Article Details

Volume / Issue Vol. 128, Issue 25
Published June 22, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

H

Haitao Hu

L

Liangyi Du

School of Science, Nanjing University of Posts and Telecommunications 1 , Nanjing 210023,

H

Huifan Chen

School of Science, Nanjing University of Posts and Telecommunications 1 , Nanjing 210023,

L

Liangliang Zhou

C

Caiyu Qiu

National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University 3 , Nanjing 210093,

Y

Yunhui Wang

School of Science, Nanjing University of Posts and Telecommunications 1 , Nanjing 210023,

P

Peng Chen

Y

Yanfeng Lyu