Effect of hydrogen on electrical properties and defects of AlGaN/GaN HEMTs

Y Y. Q. Chen F F. F. Yang (Key Laboratory of Low Dimensional Materials and Application Technology, Ministry of Education, School of Materials Science and Engineering, Xiangtan University 2 , Xiangtan 411105,) Y Y. C. Zhang (China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 511370,) C C. Liu M M. Liao (Key Laboratory of Low Dimensional Materials and Application Technology, Ministry of Education, School of Materials Science and Engineering, Xiangtan University 2 , Xiangtan 411105,) B B. J. Zeng (Key Laboratory of Low Dimensional Materials and Application Technology, Ministry of Education, School of Materials Science and Engineering, Xiangtan University 2 , Xiangtan 411105,) C Ch. Li (China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 511370,) Z Z. Q. Cai (China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 511370,)

Abstract

In this paper, the electrical characteristics of AlGaN/GaN high-electron-mobility transistors (HEMTs) were investigated after hydrogen treatment at room temperature, and the physical mechanism of hydrogen action on AlGaN/GaN HEMTs was analyzed. The ON–OFF ratio of the devices increases from 2.2 × 103 to 3.2 × 103 and the maximum transconductance also increases after hydrogen treatment, while the threshold voltage remains almost unchanged. The gate-lag characteristics of the devices after hydrogen treatment have been improved by comparing with the fresh ones. The internal defects density for the AlGaN/GaN HEMTs after hydrogen treatment is found to show more obvious decrease compared to that of the fresh ones through the characterization method of low-frequency noise. This mechanism could be attributed to the passivation of defects in the SiNx layer and at the SiNx/AlGaN interface between drain and gate electrodes by H atoms due to the forming bonds, such as N–H and Si–H. The results may be serve as useful guidelines for realizing improved design in practical applications of AlGaN/GaN HEMTs.

Article Details

Volume / Issue Vol. 126, Issue 22
Published June 02, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

Y

Y. Q. Chen

F

F. F. Yang

Key Laboratory of Low Dimensional Materials and Application Technology, Ministry of Education, School of Materials Science and Engineering, Xiangtan University 2 , Xiangtan 411105,

Y

Y. C. Zhang

China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 511370,

C

C. Liu

M

M. Liao

Key Laboratory of Low Dimensional Materials and Application Technology, Ministry of Education, School of Materials Science and Engineering, Xiangtan University 2 , Xiangtan 411105,

B

B. J. Zeng

Key Laboratory of Low Dimensional Materials and Application Technology, Ministry of Education, School of Materials Science and Engineering, Xiangtan University 2 , Xiangtan 411105,

C

Ch. Li

China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 511370,

Z

Z. Q. Cai

China Electronic Product Reliability and Environmental Testing Research Institute 1 , Guangzhou 511370,