Compliance for enhanced electroadhesion: Designing kirigami patterns for local conformation on rough surfaces

J Jennifer A. Shum (John A. Paulson School of Engineering and Applied Sciences, Harvard University 1 , Boston, Massachusetts 02134,) A Alyssa M. Hernandez P Perrin E. Schiebel (Norm Asbjornson College of Engineering, Montana State University 2 , Bozeman, Montana 59717,) K Kaushik Jayaram (College of Engineering & Applied Science, University of Colorado Boulder 3 , Boulder, Colorado 80309,) R Robert J. Wood (J. A. Paulson School of Engineering and Applied Sciences)

Abstract

We aim to improve the adhesion capabilities of electroadhesive pads on rough surfaces by using geometry-driven compliance to increase effective contact area. We present a kirigami-based approach for enhancing compliance through an exploration of geometric features cut into an adhesive disk. We experimentally test a range of geometries, comparing shear adhesion strength to understand structure–function relationships in our chosen parameter space. Our findings indicate that introducing cuts to form serpentine paths in a disk results in longer effective lengths and enhanced compliance, thus requiring less energy to deform into a rough surface. Leveraging this insight and associated scaling analysis, we conclude that serpentine-like features arranged in a radially symmetric wedge configuration achieve high levels of adhesion, even on rough surfaces, enabling robust adhesion relative to featureless electroadhesive disks.

Article Details

Volume / Issue Vol. 126, Issue 7
Published February 17, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (5)

J

Jennifer A. Shum

John A. Paulson School of Engineering and Applied Sciences, Harvard University 1 , Boston, Massachusetts 02134,

A

Alyssa M. Hernandez

P

Perrin E. Schiebel

Norm Asbjornson College of Engineering, Montana State University 2 , Bozeman, Montana 59717,

K

Kaushik Jayaram

College of Engineering & Applied Science, University of Colorado Boulder 3 , Boulder, Colorado 80309,

R

Robert J. Wood

J. A. Paulson School of Engineering and Applied Sciences