Characterizing the thermo-optic coefficient of gallium phosphide-on-insulator platform using high-quality ring resonators
Abstract
Characterizing a material's thermo-optic coefficient lays the foundation for optimizing thermal tuning of photonic integrated devices, a key feature for applications in optical communication, sensing, and signal processing. Unlike traditional bulk measurements, determining the thermo-optic coefficient (TOC) in microscale photonic devices offers significant advantages in data processing and provides more direct relevance to real-world device performance. In this work, we characterize the TOC of gallium phosphide (GaP) films using an air-cladded ring resonator, built on a GaP-on-insulator (GaP-OI) architecture. The resonator is fabricated via an optimized “etch-n-transfer” process, which incorporates silicon dioxide hard masks to enhance the precision of pattern transfer and improve the waveguide surface cleanliness, reducing defects and ensuring better device performance. The fabricated resonator exhibits a loaded quality factor of (2.18 ± 0.1)×104 at 1550 nm by using contact lithography, with a waveguide propagation loss of 23.8 ± 0.3 dB/cm. At 780 nm, the propagation loss decreases to 16.7 dB/cm. The resonator also shows a temperature-dependent wavelength shift of 65.8 pm/K, allowing us to extract a TOC of 1.19 × 10−4/K for GaP. This high temperature sensitivity empowers the GaP-OI platform particularly well-suited for rapid thermal turning, which is beneficial for a range of applications including optical sensing, optical signal processing, and highly efficient nonlinear conversion.
Article Details
Journal Info
Applied Physics Letters
American Institute of Physics
Authors (13)
Weiren Cheng
Ning Ding
Key Laboratory of Quantum Materials and Devices of Ministry of Education, School of Physics
Xucheng Zhang
Zhenyu Liu
Xingyu Tang
Center for High Pressure Science and Technology Advanced Research
Wenfu Lin
School of Microelectronics, MOE Engineering Research Center of Integrated Circuits for Next Generation Communications, Southern University of Science and Technology 1 , Shenzhen, Guangdong 518000,
Yifan Wang
Ziyu Pan
School of Microelectronics, MOE Engineering Research Center of Integrated Circuits for Next Generation Communications, Southern University of Science and Technology 1 , Shenzhen, Guangdong 518000,
Naiqin Bu
School of Microelectronics, MOE Engineering Research Center of Integrated Circuits for Next Generation Communications, Southern University of Science and Technology 1 , Shenzhen, Guangdong 518000,
Mingjian You
School of Microelectronics, MOE Engineering Research Center of Integrated Circuits for Next Generation Communications, Southern University of Science and Technology 1 , Shenzhen, Guangdong 518000,
Xingchen Ji
Yi Li
Qiancheng Zhao