Breaking the thermal–dielectric trade-off in high-temperature polymers via transfer learning

R Ruo-Jie Cheng (College of Electrical and Information Engineering, Hunan University 1 , Changsha 410082,) D Dong-Duan Liu (College of Electrical and Information Engineering, Hunan University 1 , Changsha 410082,) Q Qiao Li (Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education and School of Chemistry and Chemical Engineering) Y Yu-Jie Zhu (School of Materials Science and Engineering) F Feng Wang H Hongxiao Yang (College of Electrical and Information Engineering, Hunan University 1 , Changsha 410082,) Q Qian Zhou C Chao Yuan (Department of Preventive Dentistry)

Abstract

High-temperature capacitive energy storage demands dielectric polymers that integrate high thermal conductivity with excellent electrical insulation to mitigate thermal runaway induced by Joule heating. However, conventional strategies for improving thermal conductivity through increased aromatic conjugation frequently exacerbate conductive losses under elevated temperatures and high electric fields. To resolve this fundamental trade-off between thermal conductivity and electrical insulation, we introduce a conjugation-decoupling strategy. This approach incorporates aliphatic segments to disrupt the π–π conjugation networks, implemented through a machine learning-assisted co-design workflow. A transfer learning model is built to establish the structure–property relationship between glass transition temperature and thermal conductivity, and subsequently guides the synthesis of three semi-aromatic polyimides that concurrently achieve a high glass transition temperature, a wide bandgap, and high thermal conductivity. The resulting semi-alicyclic polyimide film demonstrated outstanding discharge energy density (5.26 J cm−3) and η = 90% performance at 200 °C, significantly outperforming commercial Kapton polyimide film. We report a strategy for high-temperature dielectric development using an interpretable machine learning model, demonstrating a concurrent enhancement of electrical insulation and thermal conductivity, properties typically constrained by a conventional trade-off.

Article Details

Volume / Issue Vol. 128, Issue 10
Published March 09, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

R

Ruo-Jie Cheng

College of Electrical and Information Engineering, Hunan University 1 , Changsha 410082,

D

Dong-Duan Liu

College of Electrical and Information Engineering, Hunan University 1 , Changsha 410082,

Q

Qiao Li

Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education and School of Chemistry and Chemical Engineering

Y

Yu-Jie Zhu

School of Materials Science and Engineering

F

Feng Wang

H

Hongxiao Yang

College of Electrical and Information Engineering, Hunan University 1 , Changsha 410082,

Q

Qian Zhou

C

Chao Yuan

Department of Preventive Dentistry