Alleviating the trade-off between thermal stability and fast switching in Ru-doped Sb3Te phase change films

C Chengnuo Zhang (Hefei National Research Center for Physical Sciences at the Microscale and Department of Chemistry, University of Science and Technology of China 96 Jinzhai Road, Hefei, Anhui 230026, P. R. China) Y Yuan Xue Y Yonghui Zheng (Key Laboratory of Polar Materials and Devices (MOE), School of Information and Electronic Engineering (School of Integrated Circuits Science and Engineering), East China Normal University, Shanghai, China.) G Guangjie Shi D Dongning Yao S Sannian Song Z Zhitang Song (State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China.) Y Yan Cheng (Key Laboratory of Polar Materials and Devices (MOE), School of Information and Electronic Engineering (School of Integrated Circuits Science and Engineering), East China Normal University, Shanghai, China.)

Abstract

Phase change memory is a promising candidate for next-generation nonvolatile memory. Improving the amorphous thermal stability of phase-change materials usually comes at the expense of crystallization speed, because suppressing nucleation tends to slow phase transition kinetics. Here, we show that Ru doping in Sb3Te films can significantly enhance thermal stability while preserving fast switching speed. Structural analyses indicate that Ru disrupts the long-range order of the crystalline phase, which improves amorphous stability. Meanwhile, transmission electron microscopy demonstrates that although long-range order is perturbed, the crystal grains largely retain an ordered internal structure with only slight orientational adjustment, minimizing the negative impact on crystal growth. This structural characteristic alleviates the trade-off between thermal stability and crystallization speed, enabling Ru-doped Sb3Te to achieve both improved data retention and rapid switching speed. These findings provide a practical strategy for designing high-performance phase change materials for embedded memory applications.

Article Details

Volume / Issue Vol. 129, Issue 4
Published July 27, 2026
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (8)

C

Chengnuo Zhang

Hefei National Research Center for Physical Sciences at the Microscale and Department of Chemistry, University of Science and Technology of China 96 Jinzhai Road, Hefei, Anhui 230026, P. R. China

Y

Yuan Xue

Y

Yonghui Zheng

Key Laboratory of Polar Materials and Devices (MOE), School of Information and Electronic Engineering (School of Integrated Circuits Science and Engineering), East China Normal University, Shanghai, China.

G

Guangjie Shi

D

Dongning Yao

S

Sannian Song

Z

Zhitang Song

State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China.

Y

Yan Cheng

Key Laboratory of Polar Materials and Devices (MOE), School of Information and Electronic Engineering (School of Integrated Circuits Science and Engineering), East China Normal University, Shanghai, China.