A perspective on mechanism of heat transfer and performance optimization in advanced thermal interface materials
Abstract
In recent years, thermal interface materials (TIMs) have garnered increasing attention in the field of thermal management for electronic devices. By effectively bridging the gap between electronic components and heat sinks, these materials significantly enhance heat transfer efficiency. This paper systematically reviews and analyzes the mechanisms, and the influencing factors associated with TIMs composed of graphene, carbon nanotubes, MXene, boron nitride compounds, and metal nanowires over recent years. Additionally, it delves into the challenges faced by these materials and explores its future research directions in thermal management. Future research endeavors are anticipated to focus on innovative designs for thermal conductivity networks in order to achieve further enhancements in the TIMs performance, ultimately paving the way for their practical application and commercialization.
Article Details
Journal Info
Applied Physics Letters
American Institute of Physics
Authors (10)
Chen Liang
MOE Key Laboratory for Non-Equilibrium Synthesis and Modulation of Condensed Matter, School of Physics
Jingtao Hong
School of Materials Science and Engineering, Beijing Institute of Technology 1 , Beijing 100081,
Cheng Wan
Xinkai Ma
School of Materials Science and Engineering, Beijing Institute of Technology 1 , Beijing 100081,
Zhiteng Wang
Key Laboratory of Applied Surface and Colloid Chemistry, Ministry of Education, Shaanxi Key Laboratory for Advanced Energy Devices, Shaanxi Engineering Lab for Advanced Energy Technology, School of Materials Science and Engineering Shaanxi Normal University Xi'an 710119 P.R. China
Xiuchen Zhao
School of Materials Science and Engineering, Beijing Institute of Technology 1 , Beijing 100081,
Aijun Hou
Yangtze River Delta Graduate School of Beijing Institute of Technology 2 , Jiaxing, Zhejiang,
Denis Nika
Faculty of Physics and Engineering, Institute of Applied Physics, Moldova State University 3 , Chisinau, Maryland 2009,
Yongjun Huo
School of Materials Science and Engineering, Beijing Institute of Technology 1 , Beijing 100081,
Gang Zhang