A non-invasive dry-transfer method for fabricating mesoscopic devices on sensitive materials

Z Zhongmou Jia (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) Y Yiwen Ma Z Zhongchen Xu (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) X Xue Yang J Jianfei Xiao (College of Electronics and Information, Qingdao University 1 , Qingdao 266071,) J Jiezhong He (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) Y Yunteng Shi (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) Z Zhiyuan Zhang D Duolin Wang (Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) S Sicheng Zhou B Bingbing Tong P Peiling Li Z Ziwei Dou (Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) X Xiaohui Song G Guangtong Liu J Jie Shen Z Zhaozheng Lyu (Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,) Y Youguo Shi (Beijing National Laboratory for Condensed Matter Physics) J Jiangping Hu L Li Lu F Fanming Qu (Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,)

Abstract

Many materials with novel or exotic properties are highly sensitive to environmental factors such as air, solvents, and heat, which complicate device fabrication and limit their potential applications. Here, we present a universal sub-micrometer fabrication method for mesoscopic devices using a dry-transfer technique, tailored specifically for sensitive materials. This approach utilizes PMMA masks, combined with a water-dissoluble coating as a sacrificial layer, to ensure that sensitive materials are processed without exposure to harmful environmental conditions. The entire fabrication process is carried out in a glovebox, employing dry techniques that avoid air, solvents, and heat exposure, culminating in an encapsulation step. We demonstrate the utility of this method by fabricating and characterizing K2Cr3As3 and WTe2 devices, a one- and two-dimensional material, respectively. The results show that our technique preserves the integrity of the materials, provides excellent contact interfaces, and is broadly applicable to a range of sensitive materials.

Article Details

Volume / Issue Vol. 126, Issue 24
Published June 16, 2025
ISSN 0003-6951
Publisher American Institute of Physics

Journal Info

Applied Physics Letters

American Institute of Physics

ISSN: 0003-6951 Physical Sciences

Authors (21)

Z

Zhongmou Jia

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

Y

Yiwen Ma

Z

Zhongchen Xu

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

X

Xue Yang

J

Jianfei Xiao

College of Electronics and Information, Qingdao University 1 , Qingdao 266071,

J

Jiezhong He

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

Y

Yunteng Shi

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

Z

Zhiyuan Zhang

D

Duolin Wang

Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

S

Sicheng Zhou

B

Bingbing Tong

P

Peiling Li

Z

Ziwei Dou

Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

X

Xiaohui Song

G

Guangtong Liu

J

Jie Shen

Z

Zhaozheng Lyu

Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,

Y

Youguo Shi

Beijing National Laboratory for Condensed Matter Physics

J

Jiangping Hu

L

Li Lu

F

Fanming Qu

Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences 1 , Beijing 100190,