Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique
Z
Zhikun Zhou
Z
Zihan Zhang
H
Hanlin Zhang
X
Xianchao Wei
W
Wei He
Q
Quhuan Shen
X
Xiuwen Bi
T
Tao Yuan
X
Xiaochen Chen
L
Lei Sang
W
Wen Huang
Article Details
Journal
Nature Communications
Volume / Issue
Vol. 16, Issue 1
Published
March 13, 2025
ISSN
2041-1723
Publisher
Nature Portfolio
Authors (11)
Z
Zhikun Zhou
Z
Zihan Zhang
H
Hanlin Zhang
X
Xianchao Wei
W
Wei He
Q
Quhuan Shen
X
Xiuwen Bi
T
Tao Yuan
X
Xiaochen Chen
L
Lei Sang
W
Wen Huang
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