Zhou, Z., Zhang, Z., Zhang, H., Wei, X., He, W., Shen, Q., Bi, X., Yuan, T., Chen, X., Sang, L., Huang, W. (2025). Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique. Nature Communications. https://doi.org/10.1038/s41467-025-57769-8