Upwind electromigration of sub-10-nm metallic nano-interconnects
Y
Youran Hong
T
Tianqi Deng
(State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering)
X
Xiyao Li
Z
Zhongkang Han
(State Key Laboratory of Silicon and Advanced Semiconductor Materials and Center of Electron Microscopy, School of Materials Science and Engineering)
J
Jian Wang
K
Kexing Song
Z
Ze Zhang
(Department of Polymer Science and Engineering)
J
Jiangwei Wang
Article Details
Journal
Nature Communications
Volume / Issue
Vol. 17, Issue 1
Published
March 06, 2026
ISSN
2041-1723
Publisher
Nature Portfolio
Authors (8)
Y
Youran Hong
T
Tianqi Deng
State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering
X
Xiyao Li
Z
Zhongkang Han
State Key Laboratory of Silicon and Advanced Semiconductor Materials and Center of Electron Microscopy, School of Materials Science and Engineering
J
Jian Wang
K
Kexing Song
Z
Ze Zhang
Department of Polymer Science and Engineering
J
Jiangwei Wang
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