Three‐Dimensional Stretchable Tactile Sensors for Robotic Bionic Skin
Abstract
ABSTRACT Stretchable tactile sensors are essential for robotic skin; however, conventional planar integration methods struggle to accommodate complex geometries, thereby limiting advanced sensing applications. Existing fabrication approaches (e.g., transfer printing) also face scalability challenges due to their reliance on preassembled planar structures. Inspired by biological systems, we propose a novel 3D fabrication strategy that integrates 3D printing, material innovation, and laser direct writing to directly construct stretchable tactile sensor arrays on 3D substrates, enabling seamless multilayer interconnections. Mimicking the 3D folded epidermis of crocodile skin, the proposed biomimetic structure exhibits performance advantages beyond those of human skin. The proof‐of‐concept sensor arrays demonstrate high responsiveness, with an amplitude response time of less than 0.5 ms and a maximum operating frequency of 473.33 Hz, along with a frequency resolution of 0.35 Hz and an angular resolution of 1°. Notably, 900 sensors were integrated onto a sub‐meter‐scale film, achieving 100% accuracy in complex pattern recognition tasks via deep learning. This approach enables a transition from 2D to scalable 3D fabrication and provides a versatile platform for next‐generation robotic bionic skin and intelligent sensing systems.
Article Details
Authors (17)
Hongwei Xie
Zhenlong Huang
Dong Cheng
Longpeng Yang
School of Materials and Energy University of Electronic Science and Technology of China Chengdu China
Yan Jiang
Experimental Center for Advanced Materials, School of Materials Science and Engineering
Mingrui Chen
State Key Laboratory of Common Mechanism Research for Major Diseases, Department of Biophysics and Structural Biology, Institute of Basic Medical Sciences Chinese Academy of Medical Sciences, School of Basic Medicine Peking Union Medical College
Yizhuo Wang
Tao Chen
Junjie Ji
Jing Liu
Tailong Wu
Shenzhen Institute For Advanced Study University of Electronic Science and Technology of China Shenzhen China
Hao Li
Tianyu Yan
Shenzhen Institute For Advanced Study University of Electronic Science and Technology of China Shenzhen China
Binbin Jiang
School of Mechanical and Energy Engineering, Zhejiang University of Science and Technology
Min Gao
Taisong Pan
Yuan Lin