Thin‐Film Batteries for On‐Chip and Wearable Applications: Advances, Challenges, and Future Perspectives

M Min Soo Kim H Ho‐Jin Lee (Department of Materials Science and Engineering Advanced Materials Program Konkuk University 120 Neungdong‐ro, Gwangjin‐gu Seoul 05029 Republic of Korea) S Subhashree Behera (Department of Energy and Materials Engineering Dongguk University Seoul 04620 Republic of Korea) S Su‐Ho Cho (National Nanofab Center 291 Daehak‐ro, Yuseong‐gu Daejeon 34141 Republic of Korea) J Ji‐Won Jung (Department of Materials Science and Engineering Advanced Materials Program Konkuk University 120 Neungdong‐ro, Gwangjin‐gu Seoul 05029 Republic of Korea) H Hyun‐Suk Kim (Department of Energy and Materials Engineering Dongguk University Seoul 04620 Republic of Korea) I Il‐Doo Kim (Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea)

Abstract

Abstract Thin‐film batteries (TFBs) are vital for powering miniaturized electronics and Internet of Things(IoT) devices, offering compact size, long cycle life, and high safety. Utilizing solid‐state electrolytes and thin‐film deposition, TFBs integrate seamlessly with microelectronic systems. Advances in fabrication methods such as magnetron sputtering and atomic layer deposition, adapted from semiconductor manufacturing, have enhanced scalability, ionic conductivity, and electrochemical performance. Direct on‐chip integration simplifies design and boosts energy efficiency, making TFBs key for next‐generation electronics. Coupling TFBs with energy‐harvesting technologies like solar cells or thermoelectrics enables self‐sustaining systems. However, challenges remain, including low areal energy density and limits to further miniaturization. Progress in materials science, electrochemistry, and microfabrication is needed to overcome these barriers. This review summarizes recent TFB advances, classifying and analyzing materials, and detailing deposition processes and their refinements. It also addresses issues in processing, packaging, and operation, and describes analytical tools for evaluating structural and chemical stability. Finally, it highlights future application prospects and unresolved questions, providing a blueprint for ongoing research and guiding innovation toward wider adoption of TFB technology.

Article Details

Volume / Issue Vol. 38, Issue 7
Published February 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (7)

M

Min Soo Kim

H

Ho‐Jin Lee

Department of Materials Science and Engineering Advanced Materials Program Konkuk University 120 Neungdong‐ro, Gwangjin‐gu Seoul 05029 Republic of Korea

S

Subhashree Behera

Department of Energy and Materials Engineering Dongguk University Seoul 04620 Republic of Korea

S

Su‐Ho Cho

National Nanofab Center 291 Daehak‐ro, Yuseong‐gu Daejeon 34141 Republic of Korea

J

Ji‐Won Jung

Department of Materials Science and Engineering Advanced Materials Program Konkuk University 120 Neungdong‐ro, Gwangjin‐gu Seoul 05029 Republic of Korea

H

Hyun‐Suk Kim

Department of Energy and Materials Engineering Dongguk University Seoul 04620 Republic of Korea

I

Il‐Doo Kim

Department of Materials Science and Engineering Korea Advanced Institute of Science and Technology (KAIST) Daejeon Republic of Korea