Thermal hot-carrier breakdown in metasurface structures based on coplanar arrays of graphene microribbons connected with wide-gap bridges

V V. Ryzhii (Research Institute of Electrical Communication, Tohoku University 1 , Sendai 980-8577,) M M. Ryzhii (School of Computer Science and Engineering, University of Aizu 3 , Aizu-Wakamatsu 965-8580,) M M. S. Shur (Electronics of the Future, Inc. 4 , Vienna, Virginia 22181-6117,) T T. Otsuji (International Research Institute of Disaster Science, Tohoku University 6 , Sendai 980-8578,) C C. Tang (Research Institute of Electrical Communication, Tohoku University 1 , Sendai 980-8577,)

Abstract

We analyze the thermal and electrical characteristics of the metasurface composed of a coplanar interdigital array of the graphene microribbons (GMRs) connected by nanobridges (NBs). These nanobridges could be implemented using graphene nanoribbons (GNRs) or black-arsenic-phosphorus (b-AsP) nanostructures. When a bias voltage applied between neighboring GMRs, it induces electron and hole two-dimensional systems within the GMRs, leading to thermionic currents that flow through the connecting NB resulting in the self-heating effect. This self-heating effect increases the thermionic currents, creating an effective positive feedback loop between the carrier effective temperature and the injected currents, and the bias voltage. This mechanism may lead to thermal breakdown enabling threshold behavior of current–voltage characteristics and yielding an S-shaped response. The devices based on the GMR/GNR and GMR/AsP metasurface structures can serve as fast voltage-controlled current switches, sensors, thermal terahertz and infrared sources, and among other applications.

Article Details

Volume / Issue Vol. 139, Issue 9
Published March 07, 2026
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (5)

V

V. Ryzhii

Research Institute of Electrical Communication, Tohoku University 1 , Sendai 980-8577,

M

M. Ryzhii

School of Computer Science and Engineering, University of Aizu 3 , Aizu-Wakamatsu 965-8580,

M

M. S. Shur

Electronics of the Future, Inc. 4 , Vienna, Virginia 22181-6117,

T

T. Otsuji

International Research Institute of Disaster Science, Tohoku University 6 , Sendai 980-8578,

C

C. Tang

Research Institute of Electrical Communication, Tohoku University 1 , Sendai 980-8577,