Thermal conductivity of cubic silicon carbide single crystals heavily doped by nitrogen

Z Zifeng Huang X Xufei Guo (School of Integrated Circuits and Beijing Advanced Innovation Center for Integrated Circuits, Peking University 1 , Beijing 100871,) Y Yunfan Yang D Da Sheng H Hui Li Y Yuxiang Wang (Key Laboratory of Photochemical Conversion and Optoelectronic Materials & CAS-HKU Joint Laboratory on New Materials) Z Zixuan Sun (Key Laboratory of Quantum Materials and Devices of Ministry of Education, School of Physics, Southeast University 1 , Nanjing 211189,) M Ming Li R Runsheng Wang Z Zhe Cheng

Abstract

High-purity single-crystal wide-bandgap semiconductor cubic silicon carbide (3C–SiC) has the second-highest thermal conductivity among wafer-scale crystals (after diamond), making it ideal for thermal management in electronic devices. However, doping—essential for electrical property tuning—may significantly affect its thermal conductivity. While numerous theoretical studies exist, experimental data remain limited. In this work, the thermal conductivity of heavily nitrogen-doped 3C–SiC single crystals grown via the top-seeded solution growth method is measured by time-domain thermoreflectance. The results show a significant reduction (up to 30%) in thermal conductivity at nitrogen doping concentrations around 2 × 1020 cm−3. The doping concentration and distribution are investigated using secondary ion mass spectroscopy and atom probe tomography, revealing an atomic-scale uniform nitrogen distribution. Experimental results show a lower thermal conductivity reduction than previous density functional theory predictions, indicating weaker phonon–electron scattering than expected. Large-area thermal conductivity measurement and mapping reveal spatially uniform thermal conductivity in 3C–SiC at the micro-to-macroscale, emphasizing its practical utility and general high quality. These findings shed light on understanding the doping effects on thermal transport in semiconductors and support further exploration of 3C–SiC for electronics thermal management.

Article Details

Volume / Issue Vol. 138, Issue 21
Published December 07, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (10)

Z

Zifeng Huang

X

Xufei Guo

School of Integrated Circuits and Beijing Advanced Innovation Center for Integrated Circuits, Peking University 1 , Beijing 100871,

Y

Yunfan Yang

D

Da Sheng

H

Hui Li

Y

Yuxiang Wang

Key Laboratory of Photochemical Conversion and Optoelectronic Materials & CAS-HKU Joint Laboratory on New Materials

Z

Zixuan Sun

Key Laboratory of Quantum Materials and Devices of Ministry of Education, School of Physics, Southeast University 1 , Nanjing 211189,

M

Ming Li

R

Runsheng Wang

Z

Zhe Cheng