Synthesis of 2D Semiconductor Lateral Patterned Heterostructures Through Carving and Follow‐Up Robust Epitaxial Growth Approach

Z Ziwei Huang (Department of Medicine, Division of Infectious Diseases and Global Public Health, School of Medicine) S Shanhao Li J Jingmei Tang H Hongmei Zhang Z Zhengwei Zhang J Jia Li B Bei Zhao C Chao Ma W Wei Deng D Di Wang Y Ying Huangfu (Hunan Key Laboratory of Two‐Dimensional Materials State Key Laboratory of Chemo and Biosensing College of Chemistry and Chemical Engineering Hunan University Changsha 410082 China) M Miaomiao Liu X Xidong Duan

Abstract

Abstract Precise control over the spatial distribution of chemical composition and electronic structure in two‐dimensional (2D) semiconductors is essential for the development of next‐generation integrated circuits. However, fabricating 2D lateral patterned heterostructures with atomically sharp interfaces and high spatial periodicity remains a significant challenge. Herein, this work reports a general strategy to synthesize 2D semiconductor lateral patterned heterostructures through carving of 2D semiconductor single crystal and the follow‐up robust epitaxial growth approach. Using the high‐speed laser carving (HSLC) technique, this work obtains precisely controlled 2D semiconductor material patterns with clean edges, which are used as a robust template for laterally epitaxial growth to produce 2D lateral periodic heterostructures, heterostructure crossbar arrays and other complex patterned heterostructures. Systematic microscopic and spectral characterization reveal that heterostructures have atomically sharp interlines. The high periodicity of these heterostructures facilitates scalable device integration, providing a practical route toward large‐area 2D electronic circuits. By constructing functional electronic components such as p‐n diode and complementary metal oxide semiconductor (CMOS) inverters arrays, this work demonstrates the potential of these heterostructures for monolithic circuit applications. This technique offers a new idea for micro/nano machining of 2D materials and lays a foundation for large‐scale integrated circuits based on 2D semiconductors.

Article Details

Volume / Issue Vol. 38, Issue 1
Published January 01, 2026
ISSN 0935-9648
Publisher Unknown Publisher

Journal Info

Advanced Materials

Unknown Publisher

ISSN: 0935-9648 Physical Sciences

Authors (13)

Z

Ziwei Huang

Department of Medicine, Division of Infectious Diseases and Global Public Health, School of Medicine

S

Shanhao Li

J

Jingmei Tang

H

Hongmei Zhang

Z

Zhengwei Zhang

J

Jia Li

B

Bei Zhao

C

Chao Ma

W

Wei Deng

D

Di Wang

Y

Ying Huangfu

Hunan Key Laboratory of Two‐Dimensional Materials State Key Laboratory of Chemo and Biosensing College of Chemistry and Chemical Engineering Hunan University Changsha 410082 China

M

Miaomiao Liu

X

Xidong Duan