Study on warpage stress in SiP packages during reflow soldering
R
R. N. Qu
D
D. S. Li
L
L. Pan
J
J. Xin
W
W. Qi
Q
Q. H. Qin
Article Details
Journal
Scientific Reports
Volume / Issue
Vol. 16, Issue 1
Published
March 20, 2026
ISSN
2045-2322
Publisher
Nature Portfolio
Authors (6)
R
R. N. Qu
D
D. S. Li
L
L. Pan
J
J. Xin
W
W. Qi
Q
Q. H. Qin
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