Stabilizing Cu0-Cuδ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia
Article Details
Authors (15)
Zeyu Li
Beijing National Laboratory for Molecular Sciences
Ming Zheng
Materials Science and Engineering Division
Chunshuang Yan
Dongqi Yang
Materials Science and Engineering Program and Walker Department of Mechanical Engineering
Ruyu Yang
Chu Zhang
MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, State Key Laboratory of Space Power-Sources, School of Chemistry and Chemical Engineering
Hengjie Liu
National Synchrotron Radiation Laboratory, State Key Laboratory of Precision and Intelligent Chemistry
Pin Song
Key Laboratory of Functional Molecular Solids, Ministry of Education, Anhui Engineering Research Center of Carbon Neutrality, College of Chemistry and Materials Science
Chenhui Yin
Zeming Qi
Daobin Liu
State Key Laboratory of Precision and Intelligent Chemistry, Hefei National Research Center for Physical Sciences at the Microscale, School of Chemistry and Materials Science
Xin Zhou
Li Song
Chade Lv
MIIT Key Laboratory of Critical Materials Technology for New Energy Conversion and Storage, State Key Laboratory of Space Power-Sources, School of Chemistry and Chemical Engineering
Guihua Yu
Materials Science and Engineering Program and Walker Department of Mechanical Engineering