Sound velocities, elasticity, hardness, and fracture toughness of novel <i>hcp</i> and <i>bcc</i> structured Ti-based medium-entropy alloys

X Xuanzhu Xu (College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,) Y Yuan Li Q Qingze Li (College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,) Y Yipeng Wang N Nanqiu Zhang (College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,) D Donghao Xu (College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,) X Xin Li Y Yongtao Zou (College of Engineering Physics, and Shenzhen Key Laboratory of Ultraintense Laser & Advanced Material Technology, Shenzhen Technology University 2 , Shenzhen 518118,)

Abstract

Sound velocities, bulk modulus (B), shear rigidity (G), Young's modulus (E), Vickers hardness (HV), and fracture toughness (KIC) of Ti-based medium-entropy alloys (MEAs) of TiZrHf, TiZrNb, and TiHfNb are investigated using ultrasonic interferometry combined with Vickers hardness measurements. It is found that the Vickers hardness of hexagonal TiZrHf MEA is achieved up to ∼6.0 GPa, which is ∼1.3 times higher than the bcc-structured TiZrNb and TiHfNb ones. Meanwhile, the fracture toughness of cubic TiZrNb and TiHfNb MEAs is ranging from 6.0 to 7.8 MPa m1/2, which is about 1.5–2 times stronger than the hcp-TiZrHf counterpart. Additionally, the hcp-TiZrHf MEA exhibits a higher Young's modulus of around 130 GPa, approximately 20 GPa higher that of the bcc-TiZrNb MEA. The underlying mechanism for improving B, G, E, KIC, and/or HV, as well as the composition and structure dependent mechanical properties are clarified by the variations in bond strength, electronic structure, and lattice distortion of Ti-based MEAs. These findings explore how microstructural characteristics affect properties such as the bulk modulus and shear rigidity of M/HEAs and provide new insights into tuning mechanical properties through the modulation of alloy compositions.

Article Details

Volume / Issue Vol. 137, Issue 11
Published March 21, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (8)

X

Xuanzhu Xu

College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,

Y

Yuan Li

Q

Qingze Li

College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,

Y

Yipeng Wang

N

Nanqiu Zhang

College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,

D

Donghao Xu

College of Applied Technology, Shenzhen University 1 , Shenzhen 518061,

X

Xin Li

Y

Yongtao Zou

College of Engineering Physics, and Shenzhen Key Laboratory of Ultraintense Laser & Advanced Material Technology, Shenzhen Technology University 2 , Shenzhen 518118,