Simultaneous improvement of glass transition temperature and dielectric properties of epoxy resin through novel curing agent molecular designs
Abstract
With the development of third-generation SiC semiconductor power devices, the thermal resistance and dielectric properties of traditional epoxy resins can no longer meet the demands of high-temperature and high-voltage operating environments. To solve this problem, a novel epoxy resin curing agent was designed in this study. Diaminodiphenyl sulfone (DDS) was used as the raw material; a substitution reaction was carried out with a trifluoromethylating electrophilic reagent [1-trifluoromethyl-1,2-benzoxazol-3(1H)-one] to obtain the novel epoxy curing agent (DDS-CF3). After curing, a highly cross-linked epoxy resin having a glass transition temperature of 312.5 °C and an AC breakdown field strength of 144.3 kV/mm was obtained. The epoxy resin maintained a low dielectric constant and low loss characteristics within the frequency range of 101–106 Hz, demonstrating excellent potential as an insulating material for semiconductor power device packaging.
Article Details
Journal Info
The Journal of Chemical Physics
American Institute of Physics
Authors (9)
Xubin Wang
State Key Laboratory of High-Performance Special Cable Technology, Harbin University of Science and Technology 1 , Harbin 150080,
Yirui Yao
State Key Laboratory of High-Performance Special Cable Technology, Harbin University of Science and Technology 1 , Harbin 150080,
Wenju Wu
School of Materials Science and Chemical Engineering, Harbin University of Science and Technology 4 , Harbin 150040,
Changhai Zhang
State Key Laboratory of High-Performance Special Cable Technology, Harbin University of Science and Technology 1 , Harbin 150080,
Hongbowen Cui
State Key Laboratory of High-Performance Special Cable Technology, Harbin University of Science and Technology 1 , Harbin 150080,
Tiandong Zhang
Chao Yin
State Key Laboratory of Flexible Electronics (LoFE) & Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
Chao Tang
Qingguo Chi
State Key Laboratory of High-Performance Special Cable Technology, Harbin University of Science and Technology 1 , Harbin 150080,