Short-term and long-term synaptic plasticity of Au/Al:WO<i>x</i>/Ti memristive synapse from 25 to 125 °C

B Binghan Wu (School of Materials Science and Engineering, Xiangtan University , Xiangtan, Hunan 411100,) S Shimin Hu (The University of Texas MD Anderson Cancer Center) J Jingmei Li H Hongjia Song (National-Provincial Laboratory of Special Function Thin Film Materials, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105, Hunan,) X Xiangli Zhong (School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,) J Jinbin Wang (Department of Agronomy, Purdue University)

Abstract

WOx-based memristors can effectively emulate short-term and long-term synaptic plasticity, making them promising for artificial synapse and neuromorphic computing chip. The high-temperature environment or the inevitable self-heating effect in chip is inescapable. However, the temperature dependence of the synaptic plasticity in WOx-based memristive synapses remains underexplored. This study investigates the effect of temperature on the short-term and long-term synaptic plasticity characteristics in Au/Al (9 at. %):WOx/Ti memristive synapses. From 25 to 125 °C, the memristive synapses maintain stable semi-volatile resistive switching properties and synaptic plasticity, including Excitatory Postsynaptic Current, Spike Amplitude-Dependent Plasticity, Spike Number-Dependent Plasticity, Long-Term Potentiation (LTP), Long-Term Depression (LTD), and Bienenstock–Cooper–Munro (BCM) sliding frequency threshold characteristics. As temperature increase, EPSC shows saturating enhancement, and post-tetanic potentiation increases. Notably, the linearity of LTP and LTD remains consistent, while the BCM frequency threshold range expands significantly (by 263.6% at 125 °C compared to 25 °C). These changes are attributed to accelerated oxygen vacancy diffusion at higher temperatures. The results confirm the feasibility of using WOx-based memristive synapses in high-temperature environments or neuromorphic computing chip.

Article Details

Volume / Issue Vol. 137, Issue 21
Published June 07, 2025
ISSN 0021-8979
Publisher American Institute of Physics

Journal Info

Journal of Applied Physics

American Institute of Physics

ISSN: 0021-8979 Physical Sciences

Authors (6)

B

Binghan Wu

School of Materials Science and Engineering, Xiangtan University , Xiangtan, Hunan 411100,

S

Shimin Hu

The University of Texas MD Anderson Cancer Center

J

Jingmei Li

H

Hongjia Song

National-Provincial Laboratory of Special Function Thin Film Materials, School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105, Hunan,

X

Xiangli Zhong

School of Materials Science and Engineering, Xiangtan University 1 , Xiangtan 411105,

J

Jinbin Wang

Department of Agronomy, Purdue University